FIG. 2B is a schematic structural view of an LED chip bonding wire of an embodiment in accordance with the present invention;
FIG. 3 shows the TMA analysis of the polyimide before and after adding the thermal curing agent;
FIG. 4 shows the particle size distributions of the heat dispersing particles with different specifications;
FIG. 5A shows the SEM image of an organosilicon-modified polyimide resin composition composite film (substrate);
FIG. 5B shows the cross-sectional scheme of an organosilicon-modified polyimide resin composition composite film (substrate) according to an embodiment of the present invention;
FIG. 5C shows the cross-sectional scheme of an organosilicon-modified polyimide resin composition composite film (substrate) according to another embodiment of the present disclosure;
FIG. 6A illustrates a perspective view of an LED light bulb according to the third embodiment of the instant disclosure;
FIG. 6B illustrates an enlarged cross-sectional view of the dashed-line circle of FIG. 6A;
FIG. 6C is a projection of a top view of an LED filament of the LED light bulb of FIG. 6A;
FIG. 7A is a perspective view of an LED light bulb according to an embodiment of the present invention;
