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Large angle illuminated LED filament light bulb

專利號
US10868227B2
公開日期
2020-12-15
申請人
JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD(CN Jiaxing)
發(fā)明人
Tao Jiang; Weihong Xu; Yukihiro Saito; Hayato Unagike; Aiming Xiong; Junfeng Xu; Yiching Chen
IPC分類
H01L33/50; H01L33/62; F21K9/237; H01L25/075
技術領域
led,filament,in,polyimide,quadrant,bulb,symmetric,light,diamine,conductive
地域: Jiaxing

摘要

An LED light bulb, comprising: a lamp housing, a bulb base, connected with the lamp housing; a stem with a stand extending to the center of the lamp housing, disposed in the lamp housing; a single flexible LED filament, disposed in the lamp housing, points of the flexible LED filament in an xyz coordinates are defined as X, Y, and Z, an x-y plane of the xyz coordinates is perpendicular to the height direction of the light bulb, a z-axis of xyz coordinates is parallel with the stem, the filament is bent into spiral in an axial direction, the diameter of the outer spiral coil of the filament is large than the diameter of the intermediate spiral coil of the LED filament in the YZ plane.

說明書

Polyimide can also be obtained by carrying out an equilibrium reaction to give a poly (amic acid) which is heated to dehydrate. In other embodiments, the polyimide backbone may have a small amount of amic acid. For example, the ratio of amic acid to imide in the polyimide molecule may be 1?3:100. Due to the interaction between amic acid and the epoxy resin, the substrate has superior properties. In other embodiments, a solid state material such as a thermal curing agent, inorganic heat dispersing particles and phosphor can also be added at the state of poly (amic acid) to give the substrate. In addition, solubilized polyimide can also be obtained by direct heating and dehydration after mixing of alicylic anhydride and diamine. Such solubilized polyimide, as an adhesive material, has a good light transmittance. In addition, it is liquid state per se; therefore, other solid materials (such as the inorganic heat dispersing particles and the phosphor) can be dispersed in the adhesive material more sufficiently.

In one embodiment for preparing the organosilicon-modified polyimide, the organosilicon-modified polyimide can be produced by dissolving the polyimide obtained by heating and dehydration after mixing a diamine and an anhydride and a siloxane diamine in a solvent. In another embodiment, the amidic acid, before converting to polyimide, is reacted with the siloxane diamine.

權利要求

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