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Organic compound, light-emitting element, light-emitting device, electronic device, and lighting device

專利號
US10868258B2
公開日期
2020-12-15
申請人
Semiconductor Energy Laboratory Co., Ltd.
發(fā)明人
Miki Kurihara; Hideko Yoshizumi; Hiromitsu Kido; Tatsuyoshi Takahashi; Satoshi Seo
IPC分類
H01L51/50; H01L51/00; C07D491/048; C07D495/04
技術(shù)領(lǐng)域
emitting,light,skeleton,8cz,layer,compound,in,phenyl,material,electron
地域: Kanagawa-ken

摘要

A novel organic compound is provided. Moreover, a light-emitting element with high emission efficiency and a long lifetime is provided. A novel organic compound having a bicarbazole skeleton and a benzofuropyrimidine skeleton or a benzothienopyrimidine skeleton that includes at least one condensed ring or two condensed rings is provided. Moreover, a light-emitting element including the organic compound is provided.

說明書

Note that a lead wiring 608 is a wiring for transmitting signals to be input to the source side driver circuit 601 and the gate side driver circuit 603 and for receiving a video signal, a clock signal, a start signal, a reset signal, and the like from a flexible printed circuit (FPC) 609 functioning as an external input terminal. Although only the FPC is illustrated here, a printed wiring board (PWB) may be attached to the FPC. The light-emitting device in this specification includes, in its category, not only the light-emitting device itself but also the light-emitting device provided with the FPC or the PWB.

Next, a cross-sectional structure of the light-emitting device is described with reference to FIG. 4B. The driver circuit portion and the pixel portion are formed over an element substrate 610. Here, the source side driver circuit 601, which is the driver circuit portion, and one pixel of the pixel portion 602 are illustrated.

In the source side driver circuit 601, a CMOS circuit is formed in which an n-channel TFT 623 and a p-channel TFT 624 are combined. The driver circuit may be formed using various circuits such as a CMOS circuit, a PMOS circuit, or an NMOS circuit. Although a driver-integrated type in which the driver circuit is formed over the substrate is described in this embodiment, the driver circuit is not necessarily formed over the substrate, and may be formed outside the substrate.

權(quán)利要求

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