Thereafter, the source portion 2060 may operate to supply the deposition material to the pixel circuit substrate D. The deposition material may pass through the opening 220op described above with reference to FIGS. 7 and 8. The deposition material that has passed through the opening 220op may be deposited on the pixel circuit substrate D. In an embodiment, during the deposition process, the pump 2072 may exhaust gas inside the chamber 2010 to the outside, thereby keeping the pressure inside the chamber 2010 the same or similar to a vacuum state.

FIG. 10 illustrates a plan view of a portion of a pixel circuit substrate including a second deposition layer (e.g., a first common layer, a second common layer, and/or an opposite electrode) formed using the second manufacturing device described above with reference to FIG. 9. FIG. 11 illustrates a cross-sectional view taken along line A-A′ and line B-B′ in FIG. 10. Hereinafter, a case where the second deposition layer is the first common layer will be mainly described. However, in other embodiments, the first deposition layer formed using the first mask assembly may be the second common layer and/or the opposite electrode.