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Method and apparatus for alignment of a line-of-sight communications link

專利號(hào)
US10868616B2
公開(kāi)日期
2020-12-15
申請(qǐng)人
OptiPulse Inc.(US NM Albuquerque)
發(fā)明人
John Richard Joseph
IPC分類
H04B10/112; H04B10/073; H04B10/116; H04B10/50
技術(shù)領(lǐng)域
laser,mesa,waveguide,optical,gsg,lasing,array,structure,contact,emitting
地域: NM NM Albuquerque

摘要

Techniques are disclosed for aligning an optical transmitter with an optical receiver for a line-of-sight communications link, wherein the optical transmitter comprises a laser array emitter, the laser array emitter comprising a plurality of laser emitting regions, wherein each of a plurality of the laser emitting regions is configured to emit laser light in a different direction such that the laser array emitter is capable of emitting laser light in a plurality of different directions. The system can run produce emissions from different laser emitting regions until a laser emitting region that is in alignment with the optical receiver is found. This aligned laser emitting region can then be selected for use to optically communicate data from the optical transmitter to the optical receiver.

說(shuō)明書(shū)

  • 713 Electrical Waveguide Substrate
  • 714 Ground Contact of GSG Electrical Waveguide
  • 715 Signal Contact of GSG Electrical Waveguide
  • 716 Solder-Bonding GSG Waveguide to Laser Chip
  • 717 Solder-Bonding GSG Waveguide to Laser Chip
  • 718 Frame structure electrically connected to N contact region of laser chip
  • FIG. 7A2 is a continuation of FIG. 7A above, and it further shows:

      • 721 Ground Contact of GSG Electrical Waveguide
      • 722 Plating on Ground Contact of GSG Electrical Waveguide
      • 723 Solder-Bonding GSG Waveguide to Laser Chip
      • 724 Signal Contact of GSG Electrical Waveguide
      • 725 Solder-Bonding GSG Waveguide to Laser Chip
      • 726 Plating on Signal Contact of GSG Electrical Waveguide
      • 727 Etched Hole Regions in Single Mesa Substrate permits oxidation to form Current Confinement Apertures
      • 728 Plating on top of P contact Metal
      • 729 Opening in Dielectric layer for electrical contact from Plating to P Contact Layer on Laser Single Mesa Structure
      • 730 Dielectric Layer

    權(quán)利要求

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