713 Electrical Waveguide Substrate
714 Ground Contact of GSG Electrical Waveguide
715 Signal Contact of GSG Electrical Waveguide
716 Solder-Bonding GSG Waveguide to Laser Chip
717 Solder-Bonding GSG Waveguide to Laser Chip
718 Frame structure electrically connected to N contact region of laser chip
FIG. 7A2 is a continuation of FIG. 7A above, and it further shows:
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- 721 Ground Contact of GSG Electrical Waveguide
- 722 Plating on Ground Contact of GSG Electrical Waveguide
- 723 Solder-Bonding GSG Waveguide to Laser Chip
- 724 Signal Contact of GSG Electrical Waveguide
- 725 Solder-Bonding GSG Waveguide to Laser Chip
- 726 Plating on Signal Contact of GSG Electrical Waveguide
- 727 Etched Hole Regions in Single Mesa Substrate permits oxidation to form Current Confinement Apertures
- 728 Plating on top of P contact Metal
- 729 Opening in Dielectric layer for electrical contact from Plating to P Contact Layer on Laser Single Mesa Structure
- 730 Dielectric Layer