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Method and apparatus for alignment of a line-of-sight communications link

專利號
US10868616B2
公開日期
2020-12-15
申請人
OptiPulse Inc.（US NM Albuquerque）
發(fā)明人
John Richard Joseph
IPC分類
H04B10/112; H04B10/073; H04B10/116; H04B10/50
技術(shù)領(lǐng)域
laser,mesa,waveguide,optical,gsg,lasing,array,structure,contact,emitting
地域： NM NM Albuquerque

摘要

Techniques are disclosed for aligning an optical transmitter with an optical receiver for a line-of-sight communications link, wherein the optical transmitter comprises a laser array emitter, the laser array emitter comprising a plurality of laser emitting regions, wherein each of a plurality of the laser emitting regions is configured to emit laser light in a different direction such that the laser array emitter is capable of emitting laser light in a plurality of different directions. The system can run produce emissions from different laser emitting regions until a laser emitting region that is in alignment with the optical receiver is found. This aligned laser emitting region can then be selected for use to optically communicate data from the optical transmitter to the optical receiver.

說明書

  • 761 Current Confinement Aperture formed by opening in Oxidation Layer
  • 762 Oxidation Layer Dielectric
  • 763 Laser Beam Propagating through Metal Opening

    • FIG. 7C is a cross sectional view of the area where the P Contact or Signal of the GSG waveguide is positioned below the Laser Chip where the N Contact Frame or single structure mesa grounded to the N contact of the laser is above the GSG Electrical Waveguide. The large gap between the Laser Ground and the P Signal Pad reduces the capacitance of the circuit enabling higher frequency operation. FIG. 7C depicts:

      • 780 Dielectric Layer
      • 781 N Type Ohmic Contact Metal
      • 782 Plating Shorting N Metal Contact to Single Ground Mesa Structure
      • 784 N Contact Layer in Epitaxial Growth
      • 785 Plating Electrically Contacted to Signal Pad on Electrical Waveguide
      • 786 Metal Signal Pad Lead on GSG Electrical Waveguide
      • 787 Plating on Ground Pad of GSG Electrical Waveguide
      • 788 Electrical Waveguide Substrate
      • 789 Gap between Conductive Signal Pad Structure and N Contact Layer Reduces Capacitance

    Process for Embodiment 3 of US Pat App Pub 2017/0033535

    權(quán)利要求

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