81 GaAs substrate
        82 Possible position for low resistance contact layer
        83 N Mirror layer after contact region
        84 Low resistance N contact region
        85 N Mirror layer after quantum wells
        86 Quantum Well Region
        87 Oxidation layers
        88 P Mirror
        89 Low resistance P Contact layer
    
    
FIG. 9 is an illustration of the first process performed, which is P metal deposit. This is typically a Ti/Pt/Au Layer on top of the highly P doped Contact Layer forming an ohmic contact. FIG. 9 shows:
    - 
    
        - 91 P Metal forming Ohmic Contact after annealing process
- 92 Low Resistance P Contact Layer
 
FIG. 10 is a top view of the etch of the epitaxial layer down to the N contact layer. FIG. 10 shows:
    - 
    
        - 1001 Etched Area to N Contact Layer
- 1002 Single Mesa Ground Structure
- 1003 Single Mesa Active Structure