In the present embodiment, the substrate unit 40 that is the housed object is housed in the first space S1. Note that although the substrate unit 40 and the connection members 50, which are for electrically connecting the substrate unit 40 to an external device, are illustrated using solid lines in the figures (excluding FIG. 1), the substrate unit 40 and the connection members 50 are not constituent elements of the case 1 according to the present embodiment. In other words, the substrate unit 40 is merely one example of an object to be housed in the case 1 according to the present embodiment. The substrate unit 40 has the following configuration.

The substrate unit 40 shown in FIGS. 9 to 11 includes a substrate 41 and a conductive member 42. The substrate 41 is obtained by forming a conductive pattern on one surface 41a (upper surface). The conduction path constituted by the conductive pattern is a conduction path for control (circuit part), and the current that flows through it is relatively smaller than the current that flows through the conduction path (circuit part) constituted by the conductive member 42.