The present disclosure relates to an electronic device.
In the related art, research on heat dissipation of the electronic devices has been made. In Japanese Unexamined Patent Application Publication No. 2008-131501 (published on Jun. 5, 2008), a portable terminal device which includes a heat absorption member absorbing heat generated from an electronic component mounted on a circuit board and in which the heat absorption member is disposed in a casing so as to face the electronic component is disclosed.
In the portable terminal device disclosed in Japanese Unexamined Patent Application Publication No. 2008-131501 (published on Jun. 5, 2008), it is not assumed that an antenna module is provided. In a case where the antenna module is provided in the portable terminal device, if heat generated from the antenna module and heat generated from the electronic component are absorbed by one heat absorption member, temperature of the heat absorption member becomes high due to the heat generated from the electronic component.
For that reason, the portable terminal device disclosed in Japanese Unexamined Patent Application Publication No. 2008-131501 (published on Jun. 5, 2008) has a problem that the heat generated from the antenna module may not be sufficiently dissipated. It is desirable to realize an electronic device capable of sufficiently dissipating heat generated from the antenna module to stabilize communication processing.