Since heat is hardly conducted between the second metal plate 24b and the third metal plate 24c and the first metal plate 24a, even if the temperature of the first metal plate 24a rises, the second metal plate 24b and the third metal plate 24c can maintain a sufficiently low temperature. A case where the antenna module 23 is provided in the vicinity of the cover glass 2, the side surface member 3, and the back surface member 4 is assumed. In this case, since heat generated from the antenna module 23 can be sufficiently absorbed and dissipated, occurrence of hot spots on the cover glass 2, the side surface member 3, and the back surface member 4 can be reduced.

The first heat generation source includes the communication modem chip 19 that controls the antenna module 23 as the first heat generation component. As described above, since the heat of the first heat generation source and the heat of the second heat generation source are absorbed by separate heat absorbers, respectively, the heat of the antenna module 23 and the heat of the communication modem chip 19 are absorbed by separate heat absorbers, respectively. With this configuration, the heat generated from each of the antenna module 23 and the communication modem chip 19 can be efficiently dissipated, and communication processing can be stabilized.