The present invention relates to a heat-dissipating component and a method for manufacturing the same.

In recent years, as heat-dissipating plates for power modules used in electric vehicles and electric railroad applications, aluminum silicon carbide composites are used in place of the conventional copper. While the thermal conductivity of aluminum silicon carbide composites is not as good as the thermal conductivity of copper, the thermal expansion coefficient thereof is 6-8 ppm/K, almost half of that of copper, which is 17 ppm/K, so the occurrence of cracking at the solder layer portion adhering the ceramic circuit board and the heat-dissipating plate that form the module is suppressed, and it is possible to obtain high reliability.

Aluminum silicon carbide composites are manufactured, for example, as described in Patent Document 1, by mixing additives into a silicon carbide powder, after which, a molded body is formed by a dry press method, an extrusion method, or an injection method, then, the molded body is baked to produce a porous molded body (preform) having silicon carbide as the main component, after which, this molded body is impregnated with an aluminum-containing metal with a method such as a non-pressurized impregnation method, a forging cast process, or a die casting process.

In addition, aluminum silicon carbide composites can be manufactured by mixing aluminum or an alloy powder thereof, into a silicon carbide powder and firing under pressure with a powder metallurgy method.