In the step of cutting out the molded body in the shape of the plate-shaped heat-dissipating component, a portion of the composited portion and the hole-formation portions is formed by cutting into a predetermined shape. In this step, for example, after cooling to room temperature, it is preferable to form the heat-dissipating component having a desired shape by cutting with a wet band saw or the like.

In the heat-dissipating component manufactured by the above-described manufacturing methods, at least a portion of the hole-formation portions is exposed at an outer peripheral surface thereof. Further, by providing the hole-formation portions with through holes, it is possible to manufacture a heat-dissipating component having a structure wherein the hole-formation portions, provided around the through holes of the plate-shaped heat dissipating-component having a composited portion impregnated with an aluminum-containing metal in the molded body containing silicon carbide, form a portion of the outer peripheral surface of the heat-dissipating component.

The present invention will be further explained with the following examples and comparative examples, though the present invention is not limited to these.

Silicon carbide powder A (NG-150, average particle size 100 μM: manufactured by Pacific Rundum Co., Ltd.), silicon carbide powder B (GC-1000 F, average particle size 10 μm: manufactured by Yakushima Denko Co., Ltd.), and a silica sol (Snowtex: manufactured by Nissan Chemical Industries Co., Ltd.,) were blended in a composition at a mass ratio of 60:40:10 and mixed for one hour with a stirring mixer.