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Heat-dissipating component and method for manufacturing same

專利號
US10869413B2
公開日期
2020-12-15
申請人
DENKA COMPANY LIMITED（JP Tokyo）
發(fā)明人
Takeshi Miyakawa; Motonori Kino
IPC分類
H01L21/48; H01L23/373; H01L23/40; C22C47/08; C22C49/06; C22C49/14; C04B35/565; H05K7/20; B22D19/14; B22D19/00; C22C47/06; B22D21/00; C04B41/51; C09K5/14; C22C21/02; C22C21/08; C22C47/12
技術(shù)領(lǐng)域
cracks,breakage,molded,heat,carbide,hole,aluminum,in,fibers,cavities
地域： Tokyo

摘要

A heat-dissipating component, and a method for manufacturing the same, the component provided with a composited portion including a plate-shaped molded body containing silicon carbide, and hole-formation portions formed in a peripheral edge portion of the composited portion; through-holes being formed in the hole formation sections; the hole-formation portions containing inorganic fibers; the molded body and the inorganic fibers being impregnated with an aluminum-containing metal; and the hole-formation portions forming a part of the outer peripheral surface of the heat-dissipating component.

說明書

2 8 no cracks and breakage 3 10 no cracks and breakage 4 12 no cracks and breakage 5 15 no cracks and breakage Comparative 0 18 0.1 75 1 4 no cracks and breakage 5.0 4.5 example10 2 8 no cracks and breakage 3 10 no cracks and breakage 4 12 no cracks and breakage 5 15 no cracks and breakage

權(quán)利要求

1
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