With the heat-dissipating component and the manufacturing method of the present invention, it is possible to suppress damage such as cracks and breakage in through holes and the periphery thereof occurring when affixing the heat-dissipating component to other components and when actually being used after being affixed and that can suppress shrinkage cavities and hole cavities during manufacture.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 illustrates the schematic structure of a conventional heat-dissipating component. FIG. 1(a) is a plan view and FIG. 1(b) is a sectional view taken along line A-A′ of FIG. 1(a).
FIG. 2 is a drawing illustrating the schematic structure of a heat-dissipating component according to one embodiment of the present invention. FIG. 2(a) is a plan view and FIG. 2(b) is a sectional view taken along line B-B′ of FIG. 2(a).
FIG. 3 is a schematic plan view of the heat-dissipating component according to one embodiment of the present invention.
FIG. 4 is a schematic side view of the heat-dissipating component seen from the outer peripheral direction.
MODES FOR CARRYING OUT THE INVENTION
Below, an embodiment of the present invention will be explained. Clearly, the present invention is not limited to these embodiments.
[Heat-Dissipating Component]
