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Manufacturing method for wiring board

專利號
US10874021B2
公開日期
2020-12-22
申請人
DISCO CORPORATION（JP Tokyo）
發(fā)明人
Ye Chen; Frank Wei
IPC分類
H05K3/26; H05K3/46; H05K3/04; B24B37/04; C25D5/48; C25D7/12; H01L21/48; H01L23/498; H01L23/00; H05K3/10; H05K3/00
技術(shù)領(lǐng)域
insulating,wiring,21a,layers,layer,circuit,21c,face,21b,step
地域： Tokyo

摘要

A method for manufacturing a wiring board that has a rewiring layer on a surface thereof includes forming an insulating layer on a core substrate, forming a groove, in which a wiring layer of a circuit pattern is to be provided, on the insulating layer, forming a metal seed layer on an exposed face of the insulating layer on which the groove is formed, electrodepositing metal, which is to form the wiring layer, by plating to fill the groove with the metal to form a metal layer on the seed layer, machining the metal layer by a cutting tool to remove the metal layer up to a position not reaching the top of the insulating layer, and performing etching or a CMP process to expose the top of the insulating layer thereby to form the wiring layer in the groove and flatten an exposed face of the wiring layer.

說明書

BACKGROUND OF THE INVENTION Field of the Invention

The present invention relates to a manufacturing method for a wiring board.

Description of the Related Art

Conventionally, a technology is known which relates to a wiring board such as an interposer or a printed wiring board in which semiconductor chips or various electric parts are mounted and incorporated such that continuity between electrodes of them and other parts is secured. The wiring board has a rewiring layer. For example, in Japanese Patent Laid-Open No. 2001-196743, a printed wiring board of the build-up type is disclosed in which conductor layers and organic insulating layers are alternately stacked on front and rear faces of a core substrate.

Japanese Patent Laid-Open No. 2013-80823 discloses a printed wiring board that is manufactured by providing a first insulating layer, which includes a reinforcing material impregnated with resin, on each of the opposite faces of a core substrate containing reinforcing material to reinforce the core substrate with the first insulating layers and then stacking a plurality of second insulating layers containing no reinforcing material on the first insulating layers. This printed wiring board suppresses warpage from being caused by a thermal history applied to the printed wiring board by configuring the core substrate and the first insulating layer so as to contain reinforcing material or by forming the first insulating layer greater in thickness than the second insulating layers.

SUMMARY OF THE INVENTION

權(quán)利要求

1
What is claimed is:1. A manufacturing method for a wiring board that includes a rewiring layer on a surface thereof, comprising:an insulating layer forming step of forming an insulating layer on a core substrate;a groove forming step of forming a groove in which a wiring layer of a circuit pattern is to be provided on the insulating layer;a seed layer forming step of forming a metal seed layer on an exposed face of the insulating layer on which the groove is formed in the groove forming step;a metal layer forming step of electrodepositing metal, which is to form the wiring layer, by a plating process to fill the groove with the metal to form a metal layer on the seed layer;a first removing step of machining the metal layer by a single point cutting tool to remove a portion of the metal layer up to a position not reaching a top of the insulating layer, a remainder of the metal layer covering the insulating layer and the filled grooves; anda second removing step of performing, after the first removing step, etching or a chemical mechanical polishing process to remove the remainder of the metal layer and to expose the top of the insulating layer thereby to form the wiring layer in the groove and flatten an exposed face of the wiring layer;wherein after the second removing step, the insulating layer forming step of forming an insulating layer on the flattened wiring layer, the groove forming step, the seed layer forming step, the metal layer forming step, the first removing step, and the second removing step are repeated to stack circuit patterns.2. A manufacturing method for a wiring board that includes a rewiring layer on a surface thereof, comprising:an insulating layer forming step of forming an insulating layer on a core substrate;a groove forming step of forming a groove in which a wiring layer of a circuit pattern is to be provided on the insulating layer;a seed layer forming step of forming a metal seed layer on an exposed face of the insulating layer on which the groove is formed in the groove forming step;a metal layer forming step of electrodepositing metal, which is to form the wiring layer, by a plating process to fill the groove with the metal to form a metal layer on the seed layer;a first removing step of machining the metal layer by a single point cutting tool to remove the metal layer, the seed layer, and a surface layer portion of the insulating layer to form the wiring layer in the groove; anda second removing step of performing, after the first removing step, etching or a chemical mechanical polishing process to flatten an exposed face of the wiring layer and remove roughness on the exposed face of the wiring layer;wherein after the second removing step, the insulating layer forming step of forming an insulating layer on the flattened wiring layer, the groove forming step, the seed layer forming step, the metal layer forming step, the first removing step, and the second removing step are repeated to stack circuit patterns.
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