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Manufacturing method for wiring board

專利號(hào)
US10874021B2
公開日期
2020-12-22
申請(qǐng)人
DISCO CORPORATION（JP Tokyo）
發(fā)明人
Ye Chen; Frank Wei
IPC分類
H05K3/26; H05K3/46; H05K3/04; B24B37/04; C25D5/48; C25D7/12; H01L21/48; H01L23/498; H01L23/00; H05K3/10; H05K3/00
技術(shù)領(lǐng)域
insulating,wiring,21a,layers,layer,circuit,21c,face,21b,step
地域： Tokyo

摘要

A method for manufacturing a wiring board that has a rewiring layer on a surface thereof includes forming an insulating layer on a core substrate, forming a groove, in which a wiring layer of a circuit pattern is to be provided, on the insulating layer, forming a metal seed layer on an exposed face of the insulating layer on which the groove is formed, electrodepositing metal, which is to form the wiring layer, by plating to fill the groove with the metal to form a metal layer on the seed layer, machining the metal layer by a cutting tool to remove the metal layer up to a position not reaching the top of the insulating layer, and performing etching or a CMP process to expose the top of the insulating layer thereby to form the wiring layer in the groove and flatten an exposed face of the wiring layer.

說(shuō)明書

The manufacturing method for a wiring board according to the first embodiment includes flattening the top 212a of the insulating layer 21a and the exposed face 211b of the circuit pattern 21b (wiring layer 21c) in the second removing step ST6. Consequently, even if the core substrate 10 itself is warped like the core substrate 10 in the present embodiment, or even if the front face 10a or the rear face 10b of the core substrate 10 is uneven, flattening of the first circuit pattern layer 21 can be achieved, and consequently, the wiring board 1 can be flattened.

Further, with the manufacturing method for a wiring board according to the first embodiment, since the insulating layer 21a formed from the ABF containing silica filler is not machined by the cutting tool 31, abrasion or chipping can be suppressed from occurring with the cutting tool 31.

權(quán)利要求

1
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