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Rotatable cold plate assembly for cooling pluggable modules

專利號(hào)
US10874032B2
公開日期
2020-12-22
申請(qǐng)人
HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP（US TX Houston）
發(fā)明人
Kevin B. Leigh; John Norton; Sunil Ganta
IPC分類
H05K7/20; H05K7/14; G06F1/20; H01L23/473; H01L23/427
技術(shù)領(lǐng)域
pluggable,cold,module,engagement,bay,in,plate,lever,may,be
地域： TX TX Houston

摘要

An example computing device includes one or more bays to receive a pluggable module, and a cold plate assembly. The cold plate assembly includes one or more cold plates to engage with the pluggable modules and transfer heat from the modules to liquid coolant. The cold plate assembly also includes a pivoting support that supports the cold plate(s) and pivots relative to the system board, and an engagement mechanism comprising a mechanical linkage with mechanical advantage attached to the pivoting support such that moving a link of the mechanical linkage causes the pivoting support to pivot between an engaged position and a disengaged position. In the engaged position, the cold plate contacts is positioned to engaged with the pluggable module, while in the disengaged position the cold plate is disengaged from the pluggable module.

說明書

The computing system 1 includes a system board 2 housed within a chassis 3, and one or more bays 600 that each are to receive a pluggable module 700 (see FIGS. 1 and 9). The computing system 1 also includes a cold plate assembly 610 that includes one or more liquid-cooled cold plates 630 (also referred to as “cold plate 630”), each associated with one of the bays 600 (see FIGS. 1 and 9).

The cold plates 630 are supported by a pivoting support 621, which can pivot (rotate) relative to the system board 2 such that the cold plates 630 move up and down. The cold plate assembly 610 also includes an engagement mechanism 650 that, when actuated, rotates the pivoting support 621, causing the cold plates 630 to engage with or disengage from their corresponding pluggable modules 700 (see FIGS. 1 and 9).

These features will be described in greater detail below in sections 1.1 through 1.5. Features that are common to many implementation examples are described below in sections 1.1 and 1.2. Certain differences between some implementation examples will be described in sections 1.4 and 1.5.

1.1. System Board, Chassis, and Bays

The system board 2 includes a printed circuit board with one or more computer components (not illustrated), such as a processor, memory, switch, etc., attached thereto. The system board 2 may also be referred to as a motherboard, a node board, a printed circuit board (PCB), a printed circuit assembly (PCA), etc.

權(quán)利要求

1
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