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Rotatable cold plate assembly for cooling pluggable modules

專利號
US10874032B2
公開日期
2020-12-22
申請人
HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP（US TX Houston）
發(fā)明人
Kevin B. Leigh; John Norton; Sunil Ganta
IPC分類
H05K7/20; H05K7/14; G06F1/20; H01L23/473; H01L23/427
技術(shù)領(lǐng)域
pluggable,cold,module,engagement,bay,in,plate,lever,may,be
地域： TX TX Houston

摘要

An example computing device includes one or more bays to receive a pluggable module, and a cold plate assembly. The cold plate assembly includes one or more cold plates to engage with the pluggable modules and transfer heat from the modules to liquid coolant. The cold plate assembly also includes a pivoting support that supports the cold plate(s) and pivots relative to the system board, and an engagement mechanism comprising a mechanical linkage with mechanical advantage attached to the pivoting support such that moving a link of the mechanical linkage causes the pivoting support to pivot between an engaged position and a disengaged position. In the engaged position, the cold plate contacts is positioned to engaged with the pluggable module, while in the disengaged position the cold plate is disengaged from the pluggable module.

說明書

The bay 600 also includes an electrical connector 602 to electrically connect the pluggable module 700 to the system board 2 (see FIGS. 1 and 9). The connector 602 may be any type of electrical connector. In some examples (see FIGS. 1-6), the electrical connector 602 is configured to mate with an electrical connector 724 that is an edge connector. In some examples (see FIGS. 9-13), the electrical connector 602 may be a land-grid-array (LGA) socket or pad array that is located below the pluggable module 700, and which engages contacts of an electrical connector 724 on a bottom of the module 700.

The figures illustrate examples of bays 600 configured to receive two specific form factors of pluggable modules 700 (described in greater detail below). However, it should be understood that the computing device 1 could also be implemented with bays 600 configured to receive any other form factor of pluggable modules 700, as long as the pluggable module 700 has a thermal interface 723 that is accessible from above by the cold plate 630. In addition, any number of bays 600 may be included in the computing device 1, and different types may be mixed within the same computing device 1.

權(quán)利要求

1
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