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Rotatable cold plate assembly for cooling pluggable modules

專利號
US10874032B2
公開日期
2020-12-22
申請人
HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP（US TX Houston）
發(fā)明人
Kevin B. Leigh; John Norton; Sunil Ganta
IPC分類
H05K7/20; H05K7/14; G06F1/20; H01L23/473; H01L23/427
技術(shù)領(lǐng)域
pluggable,cold,module,engagement,bay,in,plate,lever,may,be
地域： TX TX Houston

摘要

An example computing device includes one or more bays to receive a pluggable module, and a cold plate assembly. The cold plate assembly includes one or more cold plates to engage with the pluggable modules and transfer heat from the modules to liquid coolant. The cold plate assembly also includes a pivoting support that supports the cold plate(s) and pivots relative to the system board, and an engagement mechanism comprising a mechanical linkage with mechanical advantage attached to the pivoting support such that moving a link of the mechanical linkage causes the pivoting support to pivot between an engaged position and a disengaged position. In the engaged position, the cold plate contacts is positioned to engaged with the pluggable module, while in the disengaged position the cold plate is disengaged from the pluggable module.

說明書

The main body 631 includes a module interface 632, which is a surface of the body 631 that is to thermally couple with a thermal interface 723 of the pluggable module 700 when the cold plate is in the engaged position (see FIGS. 5A-5B and 12A-12D). The thermal interface 723 of the module 700 is a surface of an object that is thermally coupled to the heat generating component 722 of the module 700 (see FIGS. 3A and 4A). For example, the thermal interface 723 may be a surface of a heat spreader in contact with the heat-generating component 722, a surface of the heat-generating component 722 itself, etc. When the module interface 632 is thermally coupled to the thermal interface 723 of the pluggable module 700, heat generated by the heat-generating component 722 is transferred into the body 631 of the cold plate 630.

The module interface 632 may be a downward facing surface of the body 631, and may be approximately parallel to the thermal interface 723 when in the engaged position. In some examples, the module interface 632 and/or the thermal interface 723 may have a thermal interface material (TIM) disposed thereon, such that the TIM is interposed between the module interface 632 and the thermal interface 723 when they are thermally coupled. In other examples, the module interface 632 and the thermal interface 723 may have no TIM and may directly contact one another when thermally coupled.

The body 631 of the cold plate 630 is thermally conductive. For example, the body 631 may be a continuous body of a thermally conductive material, such as copper or aluminum.

權(quán)利要求

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