Rotatable cold plate assembly for cooling pluggable modules
摘要
說明書
In some examples, the method may also include manually actuating an electrical engagement lever of the module prior to causing the pivoting support of the cold plate assembly to move into an engaged position.
Thermal Transfer Device: As used herein, “thermal transfer device” refers to any device that is thermally conductive and that is configured to receive heat from one solid body via conduction (contact) and transfer the heat into a second solid body via conduction (contact). Examples include heat pipes, vapor chambers, heat spreaders, a solid bar or strip of metal, etc.
Heat pipe: As used herein, “heat pipe” refers to a specific type of thermal transfer device that includes a case (vessel) having walls that surround a sealed interior channel containing a working fluid and a wick such that the fluid transfers heat between different regions of the device by a cycle of vaporization and condensation.
Heat sink: As used herein, a “heat sink” is a device that receives heat from a solid body via conduction (contact) and dissipates that heat into air that flows around/through the heatsink. A heat sink is distinguished from other bodies that dissipate heat into air by the fact that the heat sink is specialized for this task, as evidenced by it including features, such as fins or pins, to increase the surface area of its portions that are in contact with the air to improve heat dissipation.
