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Rotatable cold plate assembly for cooling pluggable modules

專利號(hào)
US10874032B2
公開日期
2020-12-22
申請(qǐng)人
HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP(US TX Houston)
發(fā)明人
Kevin B. Leigh; John Norton; Sunil Ganta
IPC分類
H05K7/20; H05K7/14; G06F1/20; H01L23/473; H01L23/427
技術(shù)領(lǐng)域
pluggable,cold,module,engagement,bay,in,plate,lever,may,be
地域: TX TX Houston

摘要

An example computing device includes one or more bays to receive a pluggable module, and a cold plate assembly. The cold plate assembly includes one or more cold plates to engage with the pluggable modules and transfer heat from the modules to liquid coolant. The cold plate assembly also includes a pivoting support that supports the cold plate(s) and pivots relative to the system board, and an engagement mechanism comprising a mechanical linkage with mechanical advantage attached to the pivoting support such that moving a link of the mechanical linkage causes the pivoting support to pivot between an engaged position and a disengaged position. In the engaged position, the cold plate contacts is positioned to engaged with the pluggable module, while in the disengaged position the cold plate is disengaged from the pluggable module.

說明書

Thermally conductive: An object, device, or assembly (which may comprise multiple distinct bodies that are thermally coupled, and may include multiple different materials), is “thermally conductive” between two thermal interfaces if any one of the following is true: (1) a heat transfer coefficient between the thermal interfaces is 10 W·m?2·K?1 or greater at any temperature between 0° C. and 100° C., (2) the object is continuous piece of a material that has a thermal conductivity (often denoted k, λ, or κ) between the two interfaces of 1 W·m?1·K?1 or greater at any temperature between 0° C. and 100° C., (3) the object is a heat pipe, vapor chamber, continuous body of copper, or continuous body of aluminum. Examples of materials whose thermal conductivity is greater than 1 W·m?1·K?1 between 0° C. and 100° C. include almost all metals and their alloys (e.g., copper, aluminum, gold, etc.), some plastics (e.g., TECACOMP? TC compounds, CoolPoly? D-series Thermally Conductive Plastics), and many other materials.

權(quán)利要求

1
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