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Rotatable cold plate assembly for cooling pluggable modules

專(zhuān)利號(hào)
US10874032B2
公開(kāi)日期
2020-12-22
申請(qǐng)人
HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP(US TX Houston)
發(fā)明人
Kevin B. Leigh; John Norton; Sunil Ganta
IPC分類(lèi)
H05K7/20; H05K7/14; G06F1/20; H01L23/473; H01L23/427
技術(shù)領(lǐng)域
pluggable,cold,module,engagement,bay,in,plate,lever,may,be
地域: TX TX Houston

摘要

An example computing device includes one or more bays to receive a pluggable module, and a cold plate assembly. The cold plate assembly includes one or more cold plates to engage with the pluggable modules and transfer heat from the modules to liquid coolant. The cold plate assembly also includes a pivoting support that supports the cold plate(s) and pivots relative to the system board, and an engagement mechanism comprising a mechanical linkage with mechanical advantage attached to the pivoting support such that moving a link of the mechanical linkage causes the pivoting support to pivot between an engaged position and a disengaged position. In the engaged position, the cold plate contacts is positioned to engaged with the pluggable module, while in the disengaged position the cold plate is disengaged from the pluggable module.

說(shuō)明書(shū)

Various example processes were described above, with reference to various example flow charts. In the description and in the illustrated flow charts, operations are set forth in a particular order for ease of description. However, it should be understood that some or all of the operations could be performed in different orders than those described and that some or all of the operations could be performed concurrently (i.e., in parallel).

While the above disclosure has been shown and described with reference to the foregoing examples, it should be understood that other forms, details, and implementations are contemplated and may be made without departing from the inventive concept(s) of this disclosure. While the above description contains many specifics, these should not be construed as limitations on the scope of the inventive concept(s) of this disclosure, but rather as examples of some implementations thereof. In particular, in implementing the subject matter of this disclosure in practice, one can add features that are not described herein, omit certain features that are described herein, combine features described herein in relation to one example with features described in relation to another example, modify or alter features described herein, and replace features described herein with equivalents in form and function. Such modifications of the examples described herein would be apparent to those of ordinary skill in the art having the benefit of this disclosure.

Nothing said herein should be construed as implying that any particular feature or set of features or configuration thereof is necessary or critical to the invention, unless explicitly and unambiguously indicated otherwise. Although some features may be preferred or advantageous in some circumstances, this does not mean that they cannot be omitted.

權(quán)利要求

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