Rotatable cold plate assembly for cooling pluggable modules
摘要
說明書
In the description above and in the figures, some well-known structures and techniques may not be described or shown in detail (or at all) so as not to obscure the disclosure. However, those of ordinary skill in the art will understand how to implement such well-known structures and techniques in practice.
U.S. patent application Ser. No. 16/175,977 (hereinafter “the parent application”), of which this is a continuation-in-part, describes some features that are similar to certain features described herein. However, different reference numbers and naming conventions may be used herein. To ease understanding, a list of features described herein and their reference numbers is provided below, with parenthetical indications of similar features described in the parent application. This list is provided merely for convenience, and is not intended to be exhaustive, and thus failure to explicitly identify a similar feature in the list below should not interpreted to mean that there is not a similar feature in the parent application.
The features are listed hierarchically, with indentations in the list indicating relationships between features, such that sub-features of a more general feature will be indented relative to and listed below the larger feature of which they are a part. However, this is done merely for ease of understanding, and should not be interpreted as limiting the claims in any way.
- 1 computing device (liquid-cooled transceiver assembly 100, 501)
- 2 system board (system board 120, 505)
- 3 chassis
