Electronic component embedded substrate
地域：
Suwon-si
摘要
An electronic component embedded substrate includes first insulating layer having a first through portion; a first electronic component disposed in the first through portion; a second insulating layer disposed on the first insulating layer and having a second through portion; a second electronic component disposed in the second through portion; and an insulating material covering at least a portion of each of the first electronic component and the second electronic component. The first through portion and the second through portion intersect, such that a portion of the first through portion and a portion of the second through portion overlap each other, on a plane.
說明書
This application claims benefit of priority to Korean Patent Application No. 10-2019-0167955 filed on Dec. 16, 2019 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety.
The present disclosure relates to an electronic component embedded substrate.
In recent years, an electronic device such as a smartphone, PC, and the like has been required to have high performance and high functionality, as well as miniaturization and thinning of the overall size of the electronic device. Accordingly, the number of electronic components to be mounted on a printed circuit board is increasing, but the number of electronic components that can be mounted on the surface of the printed circuit board is limited. Therefore, a technology for electronic component embedded substrates embedding electronic components, such as passive elements and active elements in a printed circuit board, has been developed.
An aspect of the present disclosure is to provide an electronic component embedded substrate capable of miniaturizing a product and increasing the number of electronic components that can be embedded therein.
Another aspect of the present disclosure is to provide an electronic component embedded substrate capable of minimizing an electrical connection path.
權(quán)利要求
What is claimed is:1. An electronic component embedded substrate, comprising: a first insulating layer having a first through portion; a first electronic component disposed in the first through portion; a second insulating layer disposed on the first insulating layer and having a second through portion; a second electronic component disposed in the second through portion; and an insulating material covering at least a portion of each of the first electronic component and the second electronic component, wherein the first through portion and the second through portion intersect, such that a portion of the first through portion and a portion of the second through portion overlap each other, on a plane, wherein at least any one of the first through portion and the second through portion has a shape in which a width thereof is narrowed in a direction from the second through portion toward the first through portion. 2. The electronic component embedded substrate of claim 1 , wherein the first electronic component and the second electronic component intersect in a plan view, such that a portion of the first electronic component and a portion of the second electronic component overlap each other, on a plane. 3. The electronic component embedded substrate of claim 1 , wherein each of the first electronic component and the second electronic component has a body and an electrode, the second insulating layer is disposed above the electrode of the first electronic component, and the first insulating layer is disposed below the electrode of the second electronic component. 4. The electronic component embedded substrate of claim 1 , wherein the insulating material comprises a first insulating material covering at least a portion of the first electronic component, and a second insulating material covering at least a portion of the second electronic component. 5. The electronic component embedded substrate of claim 1 , further comprising a first wiring layer disposed on the first insulating layer, wherein the second electronic component is disposed on the first wiring layer. 6. The electronic component embedded substrate of claim 5 , wherein the second electronic component is connected to the first wiring layer through a connection conductor. 7. The electronic component embedded substrate of claim 5 , further comprising a second wiring layer disposed on a lower surface of the first insulating layer; and a third wiring layer disposed on an upper surface of the second insulating layer. 8. The electronic component embedded substrate of claim 7 , wherein the second wiring layer is buried in the lower surface of the first insulating layer. 9. The electronic component embedded substrate of claim 7 , further comprising a first via penetrating the first insulating layer, and connecting the first wiring layer and the second wiring layer to each other; and a second via penetrating the second insulating layer, and connecting the first wiring layer and the third wiring layer to each other. 10. The electronic component embedded substrate of claim 9 , further comprising a third insulating layer disposed below the first insulating layer; and a fourth wiring layer disposed on a lower surface of the third insulating layer, wherein each of the first electronic component and the second electronic component is connected to the fourth wiring layer. 11. The electronic component embedded substrate of claim 10 , further comprising a third via penetrating the third insulating layer and connecting the fourth wiring layer to each of the first electronic component and the second wiring layer. 12. The electronic component embedded substrate of claim 11 , wherein the first electronic component comprises a body and an electrode, and the third via is in contact with the electrode of the first electronic component. 13. The electronic component embedded substrate of claim 11 , wherein the third via has a tapered shape, tapered in a direction opposite to at least any one of the first via and the second via. 14. The electronic component embedded substrate of claim 1 , wherein each of the first through portion and the second through portion is a plurality of first through portions and a plurality of second through portions, each of the first electronic component and the second electronic component is a plurality of first electronic components and a plurality of second electronic components, at least one or more of the plurality of first electronic components are disposed in each of the plurality of first through portions, and at least one or more of the plurality of second electronic components are disposed in each of the plurality of second through portions. 15. An electronic component embedded substrate, comprising: a first insulating layer having a first through portion; a first wiring layer disposed on the first insulating layer; a second insulating layer disposed on the first insulating layer, and having a second through portion exposing a portion of each of the first insulating layer and the first wiring layer; a first electronic component disposed in the first through portion; a second electronic component disposed in the second through portion, and connected to the first wiring layer exposed through the second through portion; and an insulating material covering at least a portion of each of the first electronic component and the second electronic component. 16. The electronic component embedded substrate of claim 15 , wherein an electrode of the second electronic component is in contact with the first wiring layer. 17. The electronic component embedded substrate of claim 15 , wherein an electrode of the second electronic component is spaced apart from any via of the electronic component embedded substrate. 18. The electronic component embedded substrate of claim 15 , wherein the first and second electronic components are spaced apart from the insulating material. 19. An electronic component embedded substrate, comprising: a first insulating layer having a first cavity; a first electronic component disposed in a portion of the first cavity and on a level the same as a lower surface of the first insulating layer; a second insulating layer disposed on the first insulating layer and having a second cavity; a second electronic component disposed in a portion of the second cavity and on a level above a lower surface of the second insulating layer; and an insulating material covering at least a portion of each of the first electronic component and the second electronic component, wherein the first cavity and the second cavity intersect, such that the first cavity and the second cavity partially overlap each other in a plan view along a thickness direction of the substrate, wherein at least any one of the first cavity and the second cavity has a shape in which a width thereof is narrowed in a direction from the second cavity toward the first cavity.
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