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Electronic component cooling module and electronic apparatus

專利號
US10939583B2
公開日期
2021-03-02
申請人
FUJITSU LIMITED（JP Kawasaki）
發(fā)明人
Yuki Kanai
IPC分類
H05K7/20; H01L23/473
技術(shù)領(lǐng)域
tube,memories,expansion,coolant,portions,in,electronic,cooling,2a,height
地域： Kawasaki

摘要

An electronic component cooling module includes a tube disposed in parallel with an electronic component mounted on a board, in which a coolant liquid that cools the electronic component flows, and configured to include an expansion portion that expands, due to a pressure of the coolant liquid, toward the electronic component disposed beside the tube so as to be brought into surface contact with the electronic component, and a height maintaining portion that maintains a dimension in a height direction, and a supporter configured to support the tube, and a height of the tube and a height of the supporter are equal to or smaller than a height of the electronic component in a state in which the electronic component is mounted on the board.

說明書

CROSS-REFERENCE TO RELATED APPLICATION

This application is based upon and claims the benefit of priority of the prior Japanese Patent Application No. 2019-80806, filed on Apr. 22, 2019, the entire contents of which are incorporated herein by reference.

FIELD

The embodiment discussed herein is related to an electronic component cooling module and an electronic apparatus.

BACKGROUND

Nowadays, for example, an increase in the amount of communication between electronic components such as memories, an increase in the communication speed, and further, free cooling for data centers cause an increase in temperatures of installation environments of electronic apparatuses such as servers. In some cases, air channels for cooling are not sufficiently ensured due to high-density mounting of electronic components. Under such circumstances, cooling of electronic components may be insufficient even when forced air cooling is performed with system fans, Thus, known cooling devices for an electronic device employ a cooling method in which heat is received by a coolant liquid (related art is disclosed in, for example, Japanese Laid-open Patent Publication No. 2013-201165). Japanese Laid-open Patent Publication No. 2013-201165 discloses a cooling device. The cooling device includes a structure that has a gap in which the electronic device is held and that allows a coolant liquid to flow through the structure. This cooling device cools the electronic device by ensuring a contact pressure between the structure and the electronic device held in the gap the width of which reduces due to stretching of the structure.

SUMMARY

權(quán)利要求

1
What is claimed is:1. An electronic component cooling module comprising:a tube disposed in parallel with an electronic component mounted on a board, in which a coolant liquid that cools the electronic component flows, and configured to include:an expansion portion that expands, due to a pressure of the coolant liquid, toward the electronic component disposed beside the tube so as to be brought into surface contact with the electronic component, anda height maintaining portion that maintains a dimension in a height direction; anda supporter configured to support the tube,wherein a height of the tube and a height of the supporter are equal to or smaller than a height of the electronic component in a state in which the electronic component is mounted on the board.2. The electronic component cooling module according to claim 1,wherein a thickness of the expansion portion is smaller than a thickness of the height maintaining portion.3. The electronic component cooling module according to claim 1, wherein the expansion portion is formed between cover members mounted with one of the cover members over an upper end portion of the tube and another of the cover members mounted over a lower end portion of the tube.4. The electronic component cooling module according to claim 1,wherein the height maintaining portion includes a bellows-shaped portion configured to expand and contract in a direction toward the electronic component, andwherein the expansion portion approaches and is separated from the electronic component as the bellows-shaped portion expands and contracts.5. The electronic component cooling module according to claim 1,wherein the expansion portion is a bag-shaped portion.6. An electronic apparatus comprising:an electronic component inserted into a slot mounted on a board;a tube disposed in parallel with the electronic component, in which a coolant liquid that cools the electronic component flows, and configured to include:an expansion portion that expands, due to a pressure of the coolant liquid, toward the electronic component disposed beside the tube so as to be brought into surface contact with the electronic component, anda height maintaining portion that maintains a dimension in a height direction; anda supporter configured to support the tube,wherein a height of the tube and a height of the supporter are equal to or smaller than a height of the electronic component in a state in which the electronic component is mounted on the board.7. The electronic apparatus according to claim 6,wherein a thickness of the expansion portion is smaller than a thickness of the height maintaining portion.8. The electronic apparatus according to claim 6, wherein the expansion portion is formed between cover members mounted with one of the cover members over an upper end portion of the tube and another of the cover members mounted over a lower end portion of the tube.9. The electronic apparatus according to claim 6,wherein the height maintaining portion includes a bellows-shaped portion configured to expand and contract in a direction toward the electronic component, andwherein the expansion portion approaches and is separated from the electronic component as the bellows-shaped portion expands and contracts.10. The electronic apparatus according to claim 6,wherein the expansion portion is a bag-shaped portion.11. An electronic component cooling device comprising:a board;a plurality of supports mounted on the board;a plurality of tubes supported by the supports and extending along a ongitudinal direction of the board;at least one electronic component secured to the board and positioned between the plurality of tubes; anda coolant provided within the plurality of tubes;wherein the plurality of tubes comprising:an expansion portion that expands toward the at least one electronic component due to pressure exerted by the coolant; anda height maintaining portion that maintains a height of the plurality of tubes in a direction substantially perpendicular to the board.12. The electronic component cooling device of claim 11,wherein the plurality of tubes are made of rubber.13. The electronic component cooling device of claim 11,wherein a height of the plurality of tubes and a height of the plurality of supports are equal to or smaller than a height of the electronic component in a state in which the electronic component is mounted on the board.14. The electronic component cooling device of claim 11,wherein a thickness of the expansion portion is less than a thickness of the height maintaining portion.15. The electronic component cooling device of claim 11 further comprising:a pump that circulates the coolant through the plurality of tubes.16. The electronic component cooling device of claim 11,wherein the height maintaining portion comprises a bellows-shaped portion.17. The electronic component cooling device of claim 11,wherein the plurality of tubes comprise first cover members mounted on first end portion of the plurality of tubes and second cover members mounted on second end portions of the plurality of tubes.
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