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Electronic component cooling module and electronic apparatus

專利號(hào)
US10939583B2
公開(kāi)日期
2021-03-02
申請(qǐng)人
FUJITSU LIMITED(JP Kawasaki)
發(fā)明人
Yuki Kanai
IPC分類
H05K7/20; H01L23/473
技術(shù)領(lǐng)域
tube,memories,expansion,coolant,portions,in,electronic,cooling,2a,height
地域: Kawasaki

摘要

An electronic component cooling module includes a tube disposed in parallel with an electronic component mounted on a board, in which a coolant liquid that cools the electronic component flows, and configured to include an expansion portion that expands, due to a pressure of the coolant liquid, toward the electronic component disposed beside the tube so as to be brought into surface contact with the electronic component, and a height maintaining portion that maintains a dimension in a height direction, and a supporter configured to support the tube, and a height of the tube and a height of the supporter are equal to or smaller than a height of the electronic component in a state in which the electronic component is mounted on the board.

說(shuō)明書(shū)

Referring next to FIG. 12, a third modification is described. A tube 32 according to the third modification includes bellows-shaped portions 32b, 32c that expand and contract in a direction toward the memories 52, and expansion portions 32a are able to approach and be separated from the memories 52 as the bellows-shaped portions 32b, 32c expand and contract. The bellows-shaped portions 32b, 32c expand and contract in the direction toward the memories 52, and the position of the bellows-shaped portions 32b, 32c is substantially unchanged in the height direction. Thus, the bellows-shaped portions 32b and 32c each have a function of a height maintaining portion. The bellows-shaped portions 32b, 32c expand when the pressure in the bellows-shaped portions 32b, 32c increases. As a result, the expansion portions 32a move toward the memories 52 located beside the expansion portions 32a and are brought into surface contact with the memories 52. The tube 32 as described above is mounted in the server 50 such that an upper end portion 32b1 of the tube 32 is located at a position lower than the upper end portions 52a of the memories 52. Thus, the memories may be cooled by the coolant liquid 15 in a region not higher than the memories 52.

Fourth Modification

權(quán)利要求

1
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