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Integrated sensor assembly for LED-based controlled environment agriculture (CEA) lighting, and methods and apparatus employing same

專(zhuān)利號(hào)
US11013078B2
公開(kāi)日期
2021-05-18
申請(qǐng)人
Agnetix, Inc.（US CA San Diego）
發(fā)明人
Ihor Lys; Nicholas Maderas
IPC分類(lèi)
H01R33/00; F21V7/04; H05B45/12; H05B45/18; H05B47/11; H05B47/125; F21V29/58; F21V33/00; F21S4/28; F21Y115/10; F21W131/109
技術(shù)領(lǐng)域
lighting,fixture,coolant,sensor,may,in,fixtures,be,board,hydronics
地域： CA CA San Diego

摘要

An integrated sensor assembly provides multiple sensing modalities to monitor an agricultural environment, and may be employed in or used with controlled environment agriculture (CEA) systems to control and maintain improved growth conditions for various plants. In one exemplary implementation, an integrated sensor assembly includes sensors to monitor parameters important to plant growth, such as a natural light sensor, an air temperature sensor, a relative humidity sensor, an air flow sensor, a carbon dioxide (CO2) sensor, and a remote infrared (IR) temperature sensor. The sensors are mounted onto a single circuit board, which is then placed inside a housing for protection from the ambient environment. The housing can include one or more openings and apertures to facilitate sensing with protective covers where appropriate. A USB port can be included to supply electrical power and transfer of data to and from the integrated sensor assembly (e.g., to provide plug-and-play functionality).

說(shuō)明書(shū)

The LED module 400 may include one or more LED elements arranged into an array. The one or more LED elements of the LED module 400 may each emit light at a particular wavelength such that in combination, the LED module 400 irradiates plants with light at multiple wavelengths tailored to improve various aspects related to the growth of plants and operation of the controlled agricultural environment including, but not limited to improving photosynthetic rates of the plants, growth modification, and ultraviolet (UV) sterilization. The one or more LED elements may be assembled onto the frontside of a printed circuit board. An exemplary circuit layout of an LED module 400 according to one inventive implementation is shown in FIGS. 6A and 6B, which illustrates the respective halves 400A1 and 400A2 of the LED module 400A. As shown, the LED module 400A may include multiple LED elements that are distributed across the printed circuit board.

權(quán)利要求

1
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