Method for manufacturing flexible printed circuit board and flexible printed circuit board manufactured by same
地域：
Cheonan-si
摘要
Disclosed is a method for manufacturing a flexible printed circuit board and a flexible printed circuit board manufactured thereby, which minimizes a dielectric loss due to a high frequency signal and preventing a loss of the high frequency signal. The disclosed method for manufacturing the flexible printed circuit board according to an embodiment of the present disclosure includes preparing a base sheet; preparing a bonding sheet having a melting temperature lower than a melting temperature of the base sheet; forming a laminate by stacking the base sheet and the bonding sheet; and bonding by heating and pressurizing the laminate.
說明書
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This application is a National Stage of International patent application PCT/KR2017/009451, filed on Aug. 29, 2017, which claims priority to foreign Korean patent application Nos. KR 10-2016-0112070, KR 10-2016-0112071, KR 10-2016-0112072, KR 10-2016-0112073, and KR 10-2016-0112074 filed on Aug. 31, 2016, the disclosures of which are incorporated by reference in their entireties.
The present disclosure relates to a method for manufacturing a flexible printed circuit board and a flexible printed circuit board manufactured thereby, and more particularly, to a method for manufacturing a flexible printed circuit board used as a circuit using a high frequency and a flexible printed circuit board manufactured thereby.
In general, a flexible printed circuit board is a board capable of flexibly bending by forming a circuit pattern on a thin insulating film, and is widely used in a portable electronic device and an automated machine, a display product or the like that requires bending and flexibility when used by mounting therein.
The flexible printed circuit board is manufactured by adhering or die-casting a copper foil to a polyimide (PI) film. At this time, since the polyimide film has the characteristics such as high mechanical strength, heat resistance, insulation, and solvent resistance, it is widely used as a base board of the flexible printed circuit board.
權(quán)利要求
The invention claimed is:1. A flexible printed circuit board, comprising:a laminate on which a base sheet and a bonding sheet are laminated; an electrode formed on at least one surface of the upper surface and the lower surface of the laminate; a heat resistant sheet stacked on at least one surface of the upper surface and the lower surface of the laminate; and a heat blocking sheet stacked between the laminate and the heat resistant sheet, wherein a melting temperature of the bonding sheet is lower than a melting temperature of the base sheet, wherein a melting temperature of the heat resistant sheet is equal to or higher than the melting temperature of the bonding sheet, and wherein a melting temperature of the heat blocking sheet is equal to or higher than the melting temperature of the heat resistant sheet. 2. The flexible printed circuit board of claim 1 ,wherein the base sheet is a polypropylene film on which an internal terminal is formed on at least one surface of the upper surface and the lower surface thereof, and wherein the bonding sheet is one selected from a polyethylene film and a polypropylene film. 3. The flexible printed circuit board of claim 1 ,wherein the heat resistant sheet is one selected from a polyimide film and a liquid crystal polymer film, and an external plated layer is formed on one surface of the upper surface and the lower surface thereof. 4. The flexible printed circuit board of claim 1 , further comprising an anisotropic conductive layer formed on at least one surface of the upper surface and the lower surface of the laminate. 5. The flexible printed circuit board of claim 4 ,wherein the anisotropic conductive layer is an anisotropic conductive paste or an anisotropic conductive film. 6. The flexible printed circuit board of claim 4 wherein the anisotropic conductive layer is formed to cover all of the plurality of electrode parts formed on the upper surface and the lower surface of the laminate. 7. A method for manufacturing a flexible printed circuit board, comprising:preparing a base sheet; preparing a bonding sheet having a melting temperature lower than a melting temperature of the base sheet; preparing a heat resistant sheet having a melting temperature equal to or higher than the melting temperature of the bonding sheet; preparing a heat blocking sheet having a melting temperature equal to or higher than the melting temperature of the heat resistant sheet; forming a laminate by stacking the base sheet and the bonding sheet; and bonding by heating and pressurizing the laminate, wherein the forming the laminate comprises forming the laminate by alternately stacking the base sheet and the bonding sheet; stacking the heat blocking sheet on the upper surface and the lower surface of the laminate; and stacking the heat resistant sheet on the upper surface of the heat blocking sheet stacked on the upper surface of the laminate, and on the lower surface of the heat blocking sheet stacked on the lower surface of the laminate. 8. The method for manufacturing the flexible printed circuit board of claim 1 ,wherein the base sheet is a polypropylene film having an internal terminal formed on at least one surface of the upper surface and the lower surface thereof, and wherein the bonding sheet is one of a polyethylene film and a polypropylene film. 9. The method for manufacturing the flexible printed circuit board of claim 1 ,wherein the preparing the heat resistant sheet prepares the heat resistant sheet having an external plated layer formed on one surface of the upper surface and the lower surface thereof, and wherein the heat resistant sheet is one of a polyimide film and a liquid crystal polymer film. 10. The method for manufacturing the flexible printed circuit board of claim 1 , further comprising forming an anisotropic conductive layer on the upper surface and the lower surface of the laminate bonded in the bonding. 11. The method for manufacturing the flexible printed circuit board of claim 10 ,wherein the forming the anisotropic conductive layer forms the anisotropic conductive layer to cover all of one or more electrodes formed on at least one surface of the upper surface and the lower surface of the laminate. 12. The method for manufacturing the flexible printed circuit board of claim 10 ,wherein the forming the anisotropic conductive layer forms the anisotropic conductive layer by applying an anisotropic conductive paste on the upper surface and the lower surface of the laminate. 13. The method for manufacturing the flexible printed circuit board of claim 10 ,wherein the forming the anisotropic conductive layer forms the anisotropic conductive layer by bonding an anisotropic conductive film on the upper surface and the lower surface of the laminate. 14. The method for manufacturing the flexible printed circuit board of claim 1 ,wherein the bonding heats the laminate at the temperature equal to or higher than the melting temperature of the bonding sheet and lower than the melting temperature of the base sheet. 15. The method for manufacturing the flexible printed circuit board of claim 1 , further comprisingforming one or more through holes penetrating the laminate bonded in the bonding; forming a connecting plated layer on the surface of the through hole and the upper surface and the lower surface of the laminate; and forming a circuit pattern on at least one surface of the laminate by etching the connecting plated layer and an external plated layer. 16. The method for manufacturing the flexible printed circuit board of claim 15 ,wherein the forming the connecting plated layer comprises forming a first connecting plated layer on the surface of the through hole and the upper surface and the lower surface of the laminate through electroless plating; and forming a second connecting plated layer on the surface of the first connecting plated layer through electrolytic plating.
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