Hereinafter, the most preferred embodiment of the present disclosure will be described with reference to the accompanying drawings so that those skilled in the art to which the present disclosure pertains may easily practice the technical spirit of the present disclosure. First, in adding reference numerals to the components in each drawing, it is to be noted that the same components are denoted by the same reference numerals even though they are illustrated in different drawings. In addition, in the following description of the present disclosure, a detailed description of relevant known configurations or functions will be omitted when it is determined to obscure the subject matter of the present disclosure.

Referring to FIGS. 1 to 3, a method for manufacturing a flexible printed circuit board according to a first embodiment of the present disclosure includes preparing a base sheet 110 S110, preparing a bonding sheet 120 S120, preparing a heat resistant sheet 130 S130, stacking the base sheet 110, the bonding sheet 120, and the heat resistant sheet 130 S140, hot pressing S150, forming a through hole 140 S160, plating a connecting plated layer 150 S180, and forming a circuit pattern S180.

The preparing the base sheet 110 S110 prepares a polypropylene (PP) film of a low dielectric constant (hereinafter, referred to as a PP film 112). At this time, the PP film 112 is formed to have a thickness of about 40 μm.