Method for manufacturing flexible printed circuit board and flexible printed circuit board manufactured by same
摘要
說明書
The forming the electrode part S370 forms an electrode part on the upper surface and the lower surface of the printed circuit board by etching the connecting plated layer 340 and the external plated layer 340. That is, the forming the electrode part S370 forms the electrode part by removing a part of the connecting plated layer 340 and a part of the external plated layer 340 through a masking process and an etching process.
The forming the anisotropic conductive layer 350 S380 forms the anisotropic conductive layer 350 on the laminate on which the electrode part is formed by using an anisotropic conductive material.
For example, when the anisotropic conductive material is an Anisotropic Conductive Paste (ACP), the forming the anisotropic conductive layer 350 S380 forms the anisotropic conductive layer 350 by coating the anisotropic conductive material on the upper surface and the lower surface of the laminate on which the plurality of electrode parts are formed (i.e., the upper surface of the base sheet 310 stacked on the uppermost portion thereof and the lower surface of the base sheet 310 stacked on the lowermost portion thereof). At this time, the forming the anisotropic conductive layer 350 S380 applies an anisotropic conductive material in order to cover all the electrode parts formed on the laminate.
