Image sensor and electronic camera
摘要
說明書
The image sensor and the image-capturing device having been described in reference to the embodiments and the variations thereof may be adopted in a camera, a smart phone, a tablet, a built-in camera in a PC, an on-vehicle camera, a camera installed in an unmanned aircraft (such as a drone or a radio-controlled airplane) and the like.
Variation 4
The image sensor, having been described in reference to the embodiments and the variations thereof, may be adopted in a laminated sensor (laminated image sensor) configured by laminating a plurality of substrates (e.g., a plurality of semiconductor substrates). For instance, the plurality of pixels 10 may be arranged at a first-layer substrate, the electric current sources 25 and 26, the horizontal combining unit 40, the arithmetic units 50 and the A/D conversion units 80 may be disposed at a second-layer substrate and the plurality of vertical signal lines VL may be disposed between the first-layer substrate and the second-layer substrate. As an alternative, the plurality of pixels 10, the electric current sources 25 and 26 and the horizontal combining unit 40 may be disposed at the first-layer substrate and the arithmetic units 50 and the A/D conversion units 80 may be disposed at the second-layer substrate. Furthermore, the laminated sensor may include three or more layers.
While the embodiments and variations thereof have been described, the present invention is not limited to the particulars of these examples. Any other mode conceivable within the scope of the technical teaching of the present invention is within the scope of the present invention.
The disclosure of the following priority application is herein incorporated by reference:
