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Printed circuit board and printed circuit board strip

專利號
US11039536B2
公開日期
2021-06-15
申請人
LG INNOTEK CO., LTD.（KR Seoul）
發(fā)明人
Won Suk Jung; Sang Myung Lee
IPC分類
H05K1/11; H05K1/18; H05K1/02; H05K3/46
技術領域
insulating,layer,dummy,region,circuit,die,board,printed,cavity,in
地域： Seoul

摘要

A printed circuit board according to an embodiment comprises: a first insulation layer; a plurality of first cavities formed in the central region of the first insulation layer; a plurality of second cavities formed in the outer region of the first insulation layer, excluding the central region; real dies respectively disposed in the plurality of first cavities; dummy dies respectively disposed in the plurality of second cavities; a second insulation layer formed on the first insulation layer and filling the first cavities and the second cavities; and a third insulation layer disposed beneath the first insulation layer, wherein the real dies comprise substantial driving elements and the dummy dies do not comprise the driving elements.

說明書

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is the U.S. national stage application of International Patent Application No. PCT/KR2019/003832, filed Apr. 2, 2019, which claims the benefit under 35 U.S.C. § 119 of Korean Patent Application No. 10-2018-0039191, filed Apr. 4, 2018, the disclosures of each of which are incorporated herein by reference in their entirety.

TECHNICAL FIELD

Embodiments relate to a printed circuit board and, more particularly, to a component-embedded printed circuit board and a printed circuit board strip including the same.

BACKGROUND ART

With miniaturization of electronic apparatuses, electronic components include more functions or the sizes thereof may decrease.

In particular, in order to reduce the thickness of a portable terminal such as a mobile phone or a portable computer, the thicknesses of components mounted therein need to be significantly reduced. In order to miniaturize the components, there is an increasing demand to reduce the thickness of a component package and there is an increasing demand to implement high functions by mounting a plurality of integrated circuit chips for multiple functions in one component package. To this end, component package technology such as a chip-embedded printed circuit board in which a chip is embedded between upper and lower printed circuit boards has been developed. In chip-embedded printed circuit board technology, it is possible to miniaturize all package components by embedding a chip between boards and to expect the effect of improving high-frequency characteristics through an increase in the mounting density of the components, thereby improving electrical characteristics.

權利要求

1
The invention claimed is:1. A printed circuit board comprising:a first insulating layer including a plurality of first cavities formed in a first region and a plurality of second cavities formed in a second region corresponding to an outer region of the first region;a second insulating layer disposed on an upper surface of the first insulating layer;a third insulating layer disposed under a lower surface of the first insulating layer,a first via disposed to penetrate through the third insulating layer;a first die disposed in each of the plurality of first cavities; anda second die disposed in each of the plurality of second cavities,wherein the first die includes;a first body; anda driving device disposed on one surface of the first body and including a terminal directly electrically connected to the first via, andwherein the second die includes a second body and does not include a terminal and a driving device.2. The printed circuit board of claim 1, wherein an entire area of the plurality of second cavities is at least 30% of an entire area of the second region of the first insulating layer.3. The printed circuit board of claim 1, wherein the second body of the second die is formed of any one of a semiconductor material, a ceramic material, a metal material or an organic/inorganic composite material.4. The printed circuit board of claim 1, wherein a height of the second body of the second die is equal to that of the first body of the first die.5. The printed circuit board of claim 1, wherein a height of an upper surface of the second body of the second die is equal to that of the upper surface of the first insulating layer.6. The printed circuit board of claim 1,wherein an upper surface of the second body of the second die is directly in contact with a lower surface of the second insulating layer, andwherein a lower surface of the second body of the second die is directly in contact with an upper surface of the third insulating layer.7. The printed circuit board of claim 1, comprising:a first circuit pattern disposed on the second die;a second circuit pattern disposed under the second die; anda via formed to penetrate through the second die.8. The printed circuit board of claim 1,wherein the second cavities include:(2-1)-th cavities disposed in a long-axis direction of the first insulating layer; and(2-2)-th cavities disposed in a short-axis direction of the first insulating layer, andwherein a gap between the (2-1)-th cavities is equal to a gap between the plurality of first cavities.9. The printed circuit board of claim 8, wherein the gap between the (2-1)-th cavities is less than a gap between the (2-2)-th cavities.10. A printed circuit board strip comprising:a frame region located in a first region corresponding to a central region of the printed circuit board strip and including disposed therein a plurality of printed circuit board units in which at least one first die is embedded; anda dummy region located in a second region corresponding to an outer region of the printed circuit board strip and including a dummy region in which a plurality of second dies is embedded,wherein the first die includes:a first body; anda driving device disposed on one surface of the first body and including a terminal directly electrically connected to the first via, andwherein the second die includes a second body and does not include a terminal and a driving device.11. The printed circuit board strip of claim 10, wherein a plurality of cavities, into which the second die is inserted, is formed in the dummy region, and an entire area of the plurality of cavities occupies 30% or more of an entire area of the dummy region.12. The printed circuit board strip of claim 10, wherein the dummy region is a ground region.
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