The second protective layer 170 is disposed under the fifth insulating layer 150. At this time, the second protective layer 170 may include an opening (not shown) for exposing the surface of the sixth circuit pattern 151 disposed under the fifth insulating layer 150. The second protective layer 170 may include one or more layers using one or more of solder resist (SR), oxide and Au.

Meanwhile, in the first insulating layer 110, as described above, the first cavity C1 and the second cavity C2 are formed.

The real die 180 including a substantial driving device is inserted into the first cavity C1. Therefore, the first cavity C1 may be formed in a region in which the real die 180 will be disposed. That is, the first cavity C1 may be formed in a region in which the driving device is mounted.

In the first cavity C1, the real die 180 is mounted. The real die 180 may include any one of electronic components such as various devices. In addition, the devices may include any one of an active device and a passive device.

The active device refers to a device which actively uses a non-linear part and the passive device refers to a device which does not use non-linear characteristics even though both linear and non-linear characteristics exist. In addition, the passive device may include a transistor, an IC semiconductor chip, etc., and the passive device may include a capacitor, a resistor, an inductor, etc. The passive element is mounted on a board together with a general semiconductor package in order to increase a signal processing speed of a semiconductor chip, which is an active element, or to perform a filtering function.