Meanwhile, the second cavity C2 does not exceed 70% of the entire area of the outer region. That is, when the second cavity C2 exceeds 70% of the entire area of the outer region, in the process of manufacturing the printed circuit board according to formation of the second cavity C2, it is impossible to ensure rigidity of the first insulating layer 110. Therefore, reliability of the process of manufacturing the printed circuit board may be lowered.

Meanwhile, the first cavity C1 may have the same size as the second cavity C2.

Preferably, the second cavity C2 may have a width of 2.95 mm in a first direction, and have a width of 2.54 mm in a second direction. In addition, the dummy die 190 may have a width of 2.82 mm in the first direction, and have a width of 2.41 mm in the second direction.

Meanwhile, the second cavity C2 may be selectively disposed in the outer region other than the corner region of the upper surface of the first insulating layer 110.