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Oscillating heat pipe integrated thermal management system for power electronics

專利號
US11051428B2
公開日期
2021-06-29
申請人
Hamilton Sundstrand Corporation（US NC Charlotte）
發(fā)明人
Jinliang Wang; Suman Dwari
IPC分類
H05K7/20; F28F13/10; H01L23/427; H01L25/07
技術(shù)領(lǐng)域
heat,pipe,segments,transfer,plurality,plate,in,base,or,power
地域： NC NC Charlotte

摘要

Disclosed is a thermal management system for removing heat from a power electronic heat source, the system comprising: a base plate having a plurality of fluid passages there through and extending between and inlet side of the base plate and an outlet side of the base plate; and a plurality of heat transfer pipe segments respectively attached to one or more of the plurality of fluid passages at the inlet side of the base plate and the outlet side of the base plate, the plurality of heat transfer pipe segments arranged adjacent one another, the plurality of heat transfer pipe segments containing a two-phase working fluid, and the plurality of heat transfer pipe segments forming a continuous flow path through and back into the base plate for the two-phase working fluid.

說明書

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
STATEMENT OF FEDERAL SUPPORT

This invention was made with government support under DE-AR0000889 awarded by the U.S. Department of Energy. The government has certain rights in the invention.

BACKGROUND

The embodiments herein relate to systems for cooling of electronic components and more specifically to an oscillating heat pipe integrated thermal management system for power electronics.

Power electronic devices and modules are used in a wide range of applications. For example, in electric motor controllers, switches and diodes are employed to define rectifiers, inverters, and more generally, power converters. In a typical inverter, for example, incoming single or three-phase AC power is converted to DC power, and power electronic switches, such as insolated gate bipolar transistors (IGBTs) are switched to generate an output waveform from the DC power that is applied to drive a motor. Such inverter drives are particularly useful insomuch as the speed of a driven motor is a function of the frequency of the output waveform. Other similar devices may modify AC power and DC power, convert DC power to AC power and vice versa, and so forth. Other power electronic devices incorporated in such circuits may include silicon controlled rectifiers (SCRs), as examples.

Depending upon the size and rating of the circuits and components used in the power electronic circuits, a plurality of components are typically disposed on a common support or substrate to form a module. A continuing issue in such components is the management of heat that is generated by the components. In general, generated heat must be removed to protect the components from damage and to extend their useful life.

SUMMARY OF THE DISCLOSED EMBODIMENTS

權(quán)利要求

1
What is claimed is:1. A thermal management system for removing heat from a power electronic heat source, the system comprising:a base plate having a plurality of fluid passages there through and extending between an inlet side of the base plate and an outlet side of the base plate; anda plurality of heat transfer pipe segments respectively attached to one or more of the plurality of fluid passages at the inlet side of the base plate and the outlet side of the base plate, the plurality of heat transfer pipe segments arranged adjacent one another,the plurality of heat transfer pipe segments containing a two-phase working fluid, andthe plurality of heat transfer pipe segments forming a continuous flow path through and back into the base plate for the two-phase working fluid;wherein the plurality of heat transfer pipe segments form respective serpentine channels extending perpendicularly to the fluid passges.2. The system of claim 1, wherein the plurality of heat transfer pipe segments extend perpendicularly to the base plate.3. The system of claim 1, wherein each of the plurality of heat transfer pipe segments forms a closed-loop.4. The system of claim 1, wherein at least two of the plurality of heat transfer pipe segments are fluidly connected to form a closed-loop.5. The system of claim 1, wherein all of the plurality of heat transfer pipe segments are fluidly connected to form a closed-loop.6. The system of claim 1, wherein the two-phase working fluid is one of water, alcohol, methanol, or ammonia.7. The system of claim 1, wherein the plurality of heat transfer pipe segments have a diameter of between 1-4 mm.8. The system of claim 1, wherein the base plate is copper or aluminum, or titanium, or alloys.9. The system of claim 1, comprising a plurality of plate fins extending between the plurality of heat transfer pipe segments.10. The system of claim 1, comprising a porous media extending between the plurality of heat transfer pipe segments.11. The system of claim 1, wherein when transferring heat, the two-phase working fluid defines alternating liquid slugs and vapor bubbles that oscillate inside the plurality of heat transfer pipe segments, thereby forming oscillating heat pipes (OHP).12. The system of claim 11, wherein when transferring heat, one zone of the plurality of heat transfer pipe segments closest the base plate defines an evaporation zone of the oscillating heat pipe and another zone of the plurality of heat transfer pipe segments further from the base plate defines a condensation zone for the oscillating heat pipe.13. An assembly including a power electronics heat source and the system of claim 1 connected to the power electronics heat source.14. The assembly of claim 13, wherein the power electronic heat source includes at least one electronic device connected to the base plate.15. The assembly of claim 13, comprising a plurality of electronic devices arranged in a grid pattern on the base plate.16. The assembly of claim 14, wherein the at least one electronic device includes an IGBT chip or a MOSFET chip.
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