Turning to FIG. 6, a method is disclosed of removing heat from the power electronics heat sources 110 with the system 100. As shown in block 510 the method includes distributing heat generated in the power electronics heat source 110 into the base plate 130. As shown in block 520 the method includes transferring heat from the base plate 130 into the two-phase working fluid 200 charged in the plurality of heat transfer pipe segments 155 that are each connected to one or more of the plurality of fluid passages 150. As indicated in block 530, the method includes releasing heat from the plurality of heat transfer pipe segments 155 into an environment 235 surrounding the plurality of heat transfer pipe segments 155.

As indicated in block 540, the method includes transferring heat from the plurality of heat transfer pipe segments 155 into the environment through one or more of the plurality of plate fins 250 extending between the plurality of heat transfer pipe segments 155, and porous media 260 surrounding the plurality of heat transfer pipe segments 155.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present disclosure. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, element components, and/or groups thereof.