In addition to one or more of the above disclosed aspects or as an alternate the power electronic heat source includes at least one electronic device connected to the base plate.

In addition to one or more of the above disclosed aspects or as an alternate, the assembly includes a plurality of electronic devices arranged in a grid pattern on the base plate.

In addition to one or more of the above disclosed aspects or as an alternate the at least one electronic device includes an IGBT chip or a MOSFET chip.

Further disclosed is a method of removing heat from a power electronic heat source comprising: distributing heat generated in the power electronic heat source into a base plate; transferring heat from the base plate into a two-phase fluid charged through a plurality of fluid passages in the base plate and a plurality of heat transfer pipe segments that are each connected to one or more of the plurality of fluid passages, the plurality of heat transfer pipe segments forming a continuous flow path through and back into the base plate for the two-phase working fluid; and releasing heat from the plurality of heat transfer pipe segments into an environment surrounding the plurality of heat transfer pipe segments.

In addition to one or more of the above disclosed aspects or as an alternate, the method includes releasing heat from the plurality of heat transfer pipe segments into the environment through one or more of: a plurality of plate fins extending between the plurality of heat transfer pipe segments; and porous media surrounding the plurality of heat transfer pipe segments.