Electronic control unit
地域：
Kariya
摘要
An electronic control unit includes a substrate, a plurality of electronic components, and a heat sink. The plurality of electronic components are mounted on the substrate, and include an integrated circuit and a plurality of tall components. The plurality of tall components are taller than the integrated circuit. The heat sink includes a recess collectively accommodating the plurality of tall components, and is provided on a side on which the plurality of tall components are mounted on the substrate.
說(shuō)明書(shū)
This application is based on Japanese Patent Application No. 2015-77728 filed on Apr. 6, 2015, the disclosure of which is incorporated herein by reference.
The present disclosure relates to an electronic control unit.
There has been known an electronic control unit that controls operation of a motor used in an electromotive power steering system. An electronic control unit of JP5414944B2 includes a plurality of capacitors and coils on one surface side of a substrate, and a heat sink on a side corresponding to the surface side. The heat sink includes a plurality of recesses each accommodating one each of the capacitors and of the coils.
However, the heat sink in the electronic control unit of JP5414944B2 has recesses as many as the capacitors or the coils, leading to a complicated configuration of the heat sink and high production cost.
The present disclosure addresses at least one of the above issues. Thus, it is an objective of the present disclosure to provide an electronic control unit capable of reducing body size and simplifying a heat sink configuration.
權(quán)利要求
What is claimed is:1. An electronic control unit comprising:a substrate; a plurality of electronic components that are mounted on the substrate and include:an integrated circuit; a semiconductor switching element; and a plurality of tall components that are taller than the integrated circuit and the semiconductor switching element; a heat sink formed from metal positioned on and contacting a first surface of the substrate; a cover positioned over a second surface of the substrate that is opposite to the first surface and configured to cover the second surface of the substrate, and a connector positioned on the first surface of the substrate, wherein the plurality of tall components and the semiconductor switching element are mounted on the first surface of the substrate, the plurality of tall components includes at least one of a coil, a mechanical relay, and a capacitor, the heat sink comprises a first recess, a second recess, and a third recess, the first recess faces the first surface of the substrate and is configured to receive the plurality of tall components, the second recess faces the first surface of the substrate and is configured to receive the semiconductor switching element, the third recess faces the first surface of the substrate and is configured to receive the connector, the first recess comprises a first depth, which is defined as a distance in a thickness direction of the heat sink from a surface of the heat sink that contacts the substrate to a surface of the first recess that faces the substrate, the second recess comprises a second depth, which is defined as a distance in the thickness direction of the heat sink from a surface of the heat sink that contacts the substrate to a surface of the second recess that faces the substrate, the heat sink comprises a first thickness along the thickness direction, which is defined as a distance from the surface of the first recess that faces the substrate to a surface of the heat sink that faces away from the substrate, the heat sink comprises a second thickness along the thickness direction, which is defined as a distance from the surface of the second recess that faces the substrate to the surface of the heat sink that faces away from the substrate, the second thickness is greater than the first thickness, a sum of the first thickness and the first depth is equal to a sum of the second thickness and the second depth, the heat sink directly contacts the first surface of the substrate, and the first recess receives the plurality of tall components such that the plurality of tall components are enclosed by the first recess and the substrate, and an unoccupied and empty clearance is formed between a surface of the first recess and an outer periphery of the plurality of tall components, except on a substrate-side of the plurality of tall components. 2. The electronic control unit according to claim 1 , wherein:a surface of the heat sink that faces the first surface of the substrate is in direct contact with the first surface of the substrate. 3. The electronic control unit according to claim 1 , wherein:the unoccupied and empty clearance is formed around the entire outer periphery of the plurality of tall components except on the substrate-side of the plurality of tall components. 4. The electronic control unit according to claim 1 , wherein:the unoccupied and empty clearance is evenly formed. 5. The electronic control unit according to claim 1 , wherein:the first recess is formed linearly in conformity with exterior shapes of the plurality of tall components. 6. The electronic control unit according to claim 1 , wherein:a metal surface of the heat sink directly contacts the first surface of the substrate. 7. The electronic control unit according to claim 1 , wherein:an inner periphery of the cover is in contact with an outer periphery of the heat sink. 8. The electronic control unit according to claim 1 , wherein:the heat sink collectively accommodates the tall components and the semiconductor switching element. 9. The electronic control unit according to claim 1 , wherein:the cover comprises a closed-end cylindrical shape. 10. The electronic control unit according to claim 9 , wherein:the substrate is enclosed within the cover. 11. The electronic control unit according to claim 10 , wherein:the heat sink comprises peripheral edges when viewed along the thickness direction, and the cover covers a plurality of the peripheral edges of the heat sink. 12. An electromotive power steering system for a vehicle comprising:an electronic control unit comprising:a substrate; a plurality of electronic components that are mounted on the substrate and include: an integrated circuit; a semiconductor switching element; anda plurality of tall components that are taller than the integrated circuit and the semiconductor switching element, the plurality of tall components on a side of the substrate; a heat sink formed from metal positioned on and contacting a first surface of the substrate; a cover mounted on an opposite side of the substrate than the heat sink, the cover positioned over a second surface of the substrate that is opposite to the first surface and configured to cover the second surface of the substrate; and a connector positioned on the first surface of the substrate, wherein the integrated circuit is mounted on the opposite side of the substrate than the heat sink, the cover covers the integrated circuit, the plurality of electronic components include a semiconductor switching element, the semiconductor switching element is mounted on a surface of the substrate on the heat sink-side, or on a surface of the substrate on an opposite side of the substrate from the heat sink, the plurality of tall components and the semiconductor switching element constitute a circuit through which an electric current flows from a power supply of the vehicle to a motor of the electromotive power steering system, the plurality of tall components and the semiconductor switching element are mounted on the first surface of the substrate, the plurality of tall components includes at least one of a coil, a mechanical relay, and a capacitor, the integrated circuit and a microcomputer control operations of the plurality of tall components and the semiconductor switching element to control drive of the motor, the heat sink includes a first recess, a second recess, and a third recess, the first recess faces the first surface of the substrate and is configured to receive-one or more of the plurality of tall components, the second recess faces the first surface of the substrate and is configured to receive one or more of a plurality of short components, the third recess faces the first surface of the substrate and is configured to receive the connector, the first recess comprises a first depth, which is defined as a distance in a thickness direction of the heat sink from a surface of the heat sink that contacts the substrate to a surface of the first recess that faces the substrate, the second recess comprises a second depth, which is defined as a distance in the thickness direction of the heat sink from a surface of the heat sink that contacts the substrate to a surface of the second recess that faces the substrate, the one or more of the plurality of short components being shorter than the one or more of the plurality of tall components, the heat sink comprises a first thickness along the thickness direction, which is defined as a distance from the surface of the first recess that faces the substrate to a surface of the heat sink that faces away from the substrate, the heat sink comprises a second thickness along the thickness direction, which is defined as a distance from the surface of the second recess that faces the substrate to the surface of the heat sink that faces away from the substrate, the second thickness is greater than the first thickness, a sum of the first thickness and the first depth is equal to a sum of the second thickness and the second depth, the heat sink directly contacts the first surface of the substrate, the first recess receives the one or more of the plurality of tall components such that the one or more of the plurality of tall components are enclosed by the first recess and the substrate, and the first recess receives the one or more of the plurality of short components such that the one or more of the plurality of short components are enclosed by the second recess and the substrate, an unoccupied and empty clearance is formed between a surface of the first recess and an outer periphery of the one or more of the plurality of tall components, except on a substrate-side of the one or more of the plurality of tall components, and the electronic control unit further comprising a heat conduction component that is provided between the second recess and the outer periphery of the one or more of the plurality of short components except on the substrate-side of the one or more of the plurality of short components. 13. The electromotive power steering system according to claim 12 , wherein:the substrate includes:a tall region on which the plurality of tall components are mounted; a switching region on which the semiconductor switching element is mounted; and a control region on which the integrated circuit and the microcomputer are mounted; and the heat sink includes the first recess at a position corresponding to the tall region of the substrate. 14. The electromotive power steering system according to claim 13 , whereinthe first recess is disposed at a position that corresponds to the tall region of the substrate; and the second recess is disposed at a position that corresponds to the switching region of the substrate. 15. The electromotive power steering system according to claim 12 , wherein:the one or more of the plurality of short components include a plurality of short components, and the second recess collectively receives the one or more of the plurality of short components, each of which is the semiconductor switching element. 16. The electromotive power steering system according to claim 12 , wherein:a depth of the first recess is deeper than a depth of the second recess. 17. The electromotive power steering system according to claim 12 , wherein:a metal surface of the heat sink directly contacts the first surface of the substrate. 18. The electromotive power steering system according to claim 12 , wherein:the heat sink collectively accommodates the tall components and the semiconductor switching element. 19. The electromotive power steering system according to claim 18 , wherein:an inner periphery of the cover is in contact with an outer periphery of the heat sink. 20. The electromotive power steering system according to claim 1 , wherein:the cover comprises a closed-end cylindrical shape. 21. The electromotive power steering system according to claim 20 , wherein:the substrate is enclosed within the cover. 22. The electromotive power steering system according to claim 21 , wherein:the heat sink comprises peripheral edges when viewed along the thickness direction, and the cover covers a plurality of the peripheral edges of the heat sink.
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