An electronic control unit 10 includes a substrate 40, a plurality of electronic components 11-23, and a heat sink 30. The plurality of electronic components 11-23 are mounted on the substrate 40, and include an integrated circuit 22 and a plurality of tall components 16-20. The plurality of tall components 16-20 are taller than the integrated circuit 22. The heat sink 30 includes a recess 31, 32 collectively accommodating the plurality of tall components 16-20, and is provided on a side on which the plurality of tall components 16-20 are mounted on the substrate 40. Thus, the tall components 16-20 and the heat sink 30 are provided on the same surface side of the substrate 40, which makes it possible to reduce the size of the electronic control unit 10. The heat sink 30 collectively accommodates the tall components 16-20 in the recess 31, 32, which makes it possible to simplify a configuration of the heat sink 30 and reduce production cost.

While the present disclosure has been described with reference to embodiments thereof, it is to be understood that the disclosure is not limited to the embodiments and constructions. The present disclosure is intended to cover various modification and equivalent arrangements. In addition, while the various combinations and configurations, other combinations and configurations, including more, less or only a single element, are also within the spirit and scope of the present disclosure.