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Fitting structure for conductive sheet and electronic device

專利號
US11071209B2
公開日期
2021-07-20
申請人
NEC Platforms, Ltd.(JP Kanagawa)
發(fā)明人
Manabu Hayahi
IPC分類
H05K1/18; H05K3/34; H05K5/00; H01Q1/24; H01Q1/48; H05K3/00; H05K3/02
技術(shù)領(lǐng)域
conductive,insulating,sheet,layer,ground,case,adhesive,piece,sensitive,first
地域: Kawasaki

摘要

The fitting structure for a conductive sheet of this invention comprises: a conductive member which is arranged within a predetermined region in a front case of an electronic device that has the front case and a rear case, said cases being first and second case pieces that are separably joined to each other, and which is electrically connected to ground patterns of the electronic device; and a conductive sheet which is arranged within the rear case so as to face the predetermined region of the front case and comprises a conductive layer. In a state where the front case and the rear case are joined with each other, the conductive layer of the conductive sheet is in contact with the conductive member and is electrically connected to the ground patterns of the electronic device.

說明書

The first insulating layer 32 and the third insulating layer 37 are each formed of a PET film. It is only required that a material for the first insulating layer 32 have insulating properties, and, for example, polyvinyl chloride and polypropylene may be used. The first insulating layer 32 includes a cutout portion 322, and a part of the surface of the first conductive layer 31 is exposed from the cutout portion 322. One surface of the first insulating layer 32 is caused to adhere to the first conductive layer 31 through use of an adhesive or a double-sided pressure-sensitive adhesive tape.

The first conductive layer 31 and the second conductive layer 36 are each formed of an aluminum sheet.

The second insulating layer 33 and the fourth insulating layer 38 are each formed of a double-sided pressure-sensitive adhesive tape including an insulating base sheet and pressure-sensitive adhesive layers formed respectively on both sheet surfaces of the base sheet. The second insulating layer 33 is bonded to the third insulating layer 37, and further, the fourth insulating layer 38 is mainly bonded to the insulating rear case 62 (FIG. 12). The second insulating layer 33 and the fourth insulating layer 38 are not required to have such high insulating properties as those of the first and third insulating layers 32 and 37. Therefore, the thicknesses of the base sheets of the second insulating layer 33 and the fourth insulating layer 38 may be smaller than those of the first and third insulating layers 32 and 37.

權(quán)利要求

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