The first input electrode DE1 and the first output electrode SE1 may be disposed on the second insulating layer 20. The first input electrode DE1 and the first output electrode SE1 may be connected to the first area and the second area of the first oxide semiconductor pattern OSP1 through the first contact hole CH1 and the second contact hole CH2, respectively.
A third insulating layer 30 may be disposed on the second insulating layer 20 to cover the first input electrode DE1 and the first output electrode SE1. The third insulating layer 30 may provide a flat upper surface on layers therebelow. The third insulating layer 30 may include an organic material and/or an inorganic material.