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Apparatus for enhancing cooling of an electronic computing device and method of use

專利號
US11140797B1
公開日期
2021-10-05
申請人
Tamara Phipps; Matthew Schmitt; Laura Alcorn
發(fā)明人
Tamara Phipps; Matthew Schmitt; Laura Alcorn
IPC分類
G06F1/20; H05K7/20
技術(shù)領(lǐng)域
cabana,cooling,pad,computing,electronic,panels,outdoors,panel,cool,housing
地域: VA VA Sterling

摘要

An apparatus for cooling an electronic computing device is provided that includes a cooling pad. The cooling pad includes a housing and a top which has openings. A cooling object is positioned within the housing and an electronic computing device is positioned on the cooling pad top. Air within the housing flows through the openings in the cooling pad top to cool the electronic computing device.

說明書

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FIG. 9 is a diagram illustrating a top view of the cooling pad 34. More specifically, the top 36 of the cooling pad 34 includes vent openings 70 arranged in a matrix, and the door 44 is in a closed position. The cool air from the housing 64 cools the top 36 and flows through the openings 70 to facilitate cooling objects, for example, the electronic computing device 32, placed on the top 36.

The vent openings 70 have a circular cross-sectional area and may have any diameter that facilitates air flow from the housing 64 through the top 36 of the cooling pad 34. For example, the diameter of the openings 70 may be in a range between about one-eighth (?) of an inch to about one inch. Additionally, any number of openings 70 may be provided that facilitates air to flow from the housing 64 through the top 36 of the cooling pad 34. For example, the number of openings 70 may range between about one and ten thousand.

權(quán)利要求

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