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Strip-based ventilation solution for electronic equipment

專利號
US11140800B2
公開日期
2021-10-05
申請人
Cisco Technology, Inc.(US CA San Jose)
發(fā)明人
Vic Hong Chia; George Edward Curtis; Adriana del Pilar Rangel; Keith Frank Tharp; Alpesh Umakant Bhobe
IPC分類
H05K9/00; G06F1/20; H05K7/14; H05K7/20
技術(shù)領(lǐng)域
emi,strip,faceplate,computing,openings,airflow,ioms,strips,in,segments
地域: CA CA San Jose

摘要

An apparatus suitable for providing ventilation and electromagnetic interference (EMI) containment for a computing device includes a first strip and a second strip. The first strip is sized to span ventilation openings of a computing device covering. The second strip intersects the first strip while also spanning the ventilation openings. Thus, the first strip and the second strip cooperate to define airflow openings within the ventilation openings, the airflow openings being sized to inhibit EMI from exiting the computing device via the ventilation openings.

說明書

TECHNICAL FIELD

The present disclosure relates to high performance and high density computing solutions, such as line cards and computing blades, and in particular to cooling these computing solutions while providing optimized electromagnetic interference (EMI) shielding.

BACKGROUND

Over the past several years, the information technology field has seen a tremendous increase in the performance of electronic equipment coupled with a decrease in geometric floor space to house the equipment. Further, increased performance requirements have led to increased energy use, resulting in increased heat dissipation within the crowded floor space. Put another way, application-specific integrated circuit (ASIC)/field-programmable gate array (FPGA) technology has been advancing per Moore's law, while, unfortunately, cooling technology (e.g., fan technology) has not improved at the same pace (e.g., due to limitations associated with acoustic and thermal impedance). Moreover, cooling passages are often limited by electromagnetic interference (EMI) constraints, which often limit the size of openings that can be included on a computing device's covering. As a result, there is a demand for improved thermal management solutions for computing components and/or computing components with improved thermal characteristics.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a top perspective view of an example embodiment of a computing device on which the ventilation solution presented herein may be installed, according to an example embodiment.

權(quán)利要求

1
What is claimed is:1. An apparatus suitable for providing ventilation and electromagnetic interference (EMI) containment for a computing device, the apparatus comprising:a first strip formed from a first plurality of planar segments that are collectively sized to span a width of ventilation openings of a computing device covering; anda second strip formed from a second plurality of planar segments that are collectively sized to span the width of the ventilation openings, wherein the second strip is aligned with the first strip in a vertical direction of the ventilation openings and intersects the first strip so that the first strip and the second strip cooperate to define airflow openings extending in a depth direction within the ventilation openings, the airflow openings being sized to attenuate EMI generated by the computing device.2. The apparatus of claim 1, wherein the second strip intersects the first strip by overlapping and interlocking with the first strip.3. The apparatus of claim 2, wherein:the first plurality of planar segments comprises a plurality of first interlocking segments; andthe second plurality of planar segments comprises a plurality of second interlocking segments, wherein the plurality of first interlocking segments engage the plurality of second interlocking segments when the first strip and the second strip overlap and interlock.4. The apparatus of claim 3, wherein:segments of the plurality of first interlocking segments each comprise a first main body and first slots arranged along a first edge of the first main body;segments of the plurality of second interlocking segments each comprise a second main body and second slots arranged along a second edge of the second main body; andthe first slots are arranged to mate with the second slots when the first strip and the second strip overlap and interlock.5. The apparatus of claim 3, wherein:the first plurality of planar segments further comprises one or more first engagement segments disposed between sets of segments from the plurality of first interlocking segments;the second plurality of planar segments further comprises one or more second engagement segments disposed between sets of segments from the plurality of second interlocking segments; andthe sets of the second interlocking segments are sized to align the one or more second engagement segments with the one or more first engagement segments when the first strip and the second strip overlap and interlock.6. The apparatus of claim 1, wherein a shape of the first strip resembles a first triangular waveform, a shape of the second strip resembles a second triangular waveform, and the first triangular waveform and the second triangular waveform are antiphase triangular waveforms.7. The apparatus of claim 1, wherein the EMI is a first EMI with a first frequency, the airflow openings are first airflow openings, and the apparatus further comprises:a third strip that intersects the first strip and the second strip while also spanning the width of the ventilation openings so that the first strip, the second strip, and the third strip cooperate to define at least second airflow openings within the ventilation openings, the second airflow openings being sized to attenuate second EMI of a second frequency generated by the computing device.8. The apparatus of claim 7, further comprising:a fourth strip that intersects the first strip, the second strip, and the third strip while also spanning the width of the ventilation openings so that the first strip, the second strip, the third strip, and the fourth strip cooperate to define at least third airflow openings within the ventilation openings, the third airflow openings being sized to attenuate third EMI of a third frequency generated by the computing device.9. A computing device comprising:one or more computing components that generate heat and electromagnetic interference (EMI) during operations of the computing device;a ventilation area in fluid communication with the one or more computing components; andan EMI containment component formed from two or more intersecting strips that are each formed from a plurality of planar segments, wherein the two or more intersecting strips are aligned in a vertical direction of the ventilation area and span a width of the ventilation area so that the two or more intersecting strips define airflow openings extending in a depth direction within the ventilation area, the airflow openings being sized to attenuate the EMI.10. The computing device of claim 9, wherein the airflow openings provide an open air ratio greater than 90% within the ventilation area.11. The computing device of claim 9, further comprising,a faceplate that defines one or more ventilation openings aligned with the ventilation area, wherein the airflow openings span the one or more ventilation openings.12. The computing device of claim 11, wherein the one or more ventilation openings are unmachined and form unimpeded conduits between an interior of the computing device and an exterior of the computing device.13. The computing device of claim 11, wherein the one or more ventilation openings extend latitudinally across an area of the faceplate.14. The computing device of claim 9, wherein the EMI containment component is a metal component, and the computing device further comprises:a metal covering that extends around at least one of the one or more computing components; andone or more metal posts that secure the EMI containment component within the ventilation area, wherein the EMI containment component, the one or more metal posts, and the metal covering form a Faraday cage around the one or more computing components of the computing device.15. The computing device of claim 9, wherein the two or more intersecting strips overlap and interlock.16. The computing device of claim 9, wherein the EMI containment component is customizable to adjust a size of the airflow openings.17. The computing device of claim 9, wherein the two or more intersecting strips include a first strip and a second strip, the first strip having a shape resembling a first triangular waveform, the second strip having a shape resembling a second triangular waveform, and the first triangular waveform and the second triangular waveform are antiphase triangular waveforms.18. A method comprising:providing an electromagnetic interference (EMI) containment component formed from two or more intersecting strips that are each formed from a plurality of planar segments; andinstalling the EMI containment component in a ventilation area of a computing device with the two or more intersecting strips aligned in a vertical direction of the ventilation area while spanning a width of the ventilation area so that the EMI containment component defines airflow openings that extend in a depth direction within ventilation openings of the computing device, the airflow openings being sized to attenuate EMI generated by the computing device.19. The method of claim 18, further comprising:installing a faceplate over the ventilation openings, the faceplate defining unmachined vents that align with the ventilation openings.20. The method of claim 18, wherein the two or more intersecting strips include a first strip and a second strip, the first strip having a shape resembling a first triangular waveform, the second strip having a shape resembling a second triangular waveform, and the first triangular waveform and the second triangular waveform are antiphase triangular waveforms.
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