FIGS. 11 and 12 show front views of a computing device 10 including the EMI containment component 250 while in its first configuration C1 and while in its third configuration C3, respectively. Notably, regardless of its configuration, the EMI containment component 250 spans the ventilation area 24 and is sandwiched between the IOMs 56 and the top cover 30 of the computing device. Thus, the airflow openings defined by the EMI containment component 250 are aligned with the ventilation openings 120 defined by the faceplate 100 and help to define channels for a cooling media, such as ambient air, to flow into the computing device 10 (e.g., when drawn in by fans, which are not shown) through the front 20 of the computing device 10 (e.g., to the computing components 52 and/or their heat sinks 54).
