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Resource slicing on a sidelink interface

專利號
US11159935B2
公開日期
2021-10-26
申請人
QUALCOMM Incorporated（US CA San Diego）
發(fā)明人
Hong Cheng; Sudhir Kumar Baghel; Shailesh Patil; Michaela Vanderveen; Junyi Li; Zhibin Wu; Kapil Gulati
IPC分類
H04W8/18; H04W4/40; H04W76/27; H04W72/04; H04W88/02
技術(shù)領(lǐng)域
ue,slice,d2d,resource,identifier,or,sidelink,may,allocation,in
地域： CA CA San Diego

摘要

Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may determine a service type to be used by the UE for one or more device-to-device (D2D) communications on a sidelink interface; determine a slice identifier based at least in part on the service type, wherein the slice identifier corresponds to a resource allocation to be used for the one or more D2D communications; and transmit an indication of the slice identifier. Numerous other aspects are provided.

說明書

In a seventh aspect, alone or in combination with one or more of the first through sixth aspects, the UE may communicate using a set of resources of the resource allocation. In an eighth aspect, alone or in combination with one or more of the first through seventh aspects, the slice identifier indicates at least one of a slice type associated with the service type, a sub-slice type associated with the service type, a slice instance associated with the service type, or a combination thereof. In a ninth aspect, alone or in combination with one or more of the first through eighth aspects, the UE may indicate a requested duration for use of a slice identified by the slice identifier, a requested slice size associated with the slice identifier, or a combination thereof.

權(quán)利要求

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