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Resource slicing on a sidelink interface

專利號
US11159935B2
公開日期
2021-10-26
申請人
QUALCOMM Incorporated（US CA San Diego）
發(fā)明人
Hong Cheng; Sudhir Kumar Baghel; Shailesh Patil; Michaela Vanderveen; Junyi Li; Zhibin Wu; Kapil Gulati
IPC分類
H04W8/18; H04W4/40; H04W76/27; H04W72/04; H04W88/02
技術(shù)領(lǐng)域
ue,slice,d2d,resource,identifier,or,sidelink,may,allocation,in
地域： CA CA San Diego

摘要

Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may determine a service type to be used by the UE for one or more device-to-device (D2D) communications on a sidelink interface; determine a slice identifier based at least in part on the service type, wherein the slice identifier corresponds to a resource allocation to be used for the one or more D2D communications; and transmit an indication of the slice identifier. Numerous other aspects are provided.

說明書

As further shown in FIG. 8, in some aspects, process 800 may include indicating at least one of the slice identifier or the resource allocation to one or more UEs in a coverage area of the base station (block 820). For example, the base station (e.g., using controller/processor 240, transmit processor 220, TX MIMO processor 230, MOD 232, antenna 234, and/or the like) may indicate at least one of the slice identifier or the resource allocation to one or more UEs in a coverage area of the base station, as described above in connection with FIG. 5.

Process 800 may include additional aspects, such as any single aspect or any combination of aspects described below and/or in connection with one or more other processes described elsewhere herein.

權(quán)利要求

1
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