Referring now to FIGS. 2A and 2B, an embodiment of a processing device 200 is illustrated that may utilize the micro-strand heat dissipation system of the present disclosure. In many of the examples discussed below, the processing device 200 is described as being provided by a silicon photonics integrated circuit. However, one of skill in the art in possession of the present disclosure will recognize that the processing device 200 may be provided by other processing devices, integrated circuits, and/or heat producing devices while remaining within the scope of the present disclosure as well. In an embodiment, the processing device 200 may be provided as the processor 102 in the IHS 100 discussed above with reference to FIG. 1, or the functionality of the micro-strand heat dissipation system of the present disclosure may be utilized with another heat producing device that is included in the IHS 100. As such, while illustrated and discussed as a processing device, one of skill in the art in possession of the present disclosure will recognize that devices utilizing the micro-strand heat dissipation system of the present disclosure may include any heat producing devices that may be configured to operate similarly as the processing device 200 discussed below.
