Micro-strand heat dissipation system
摘要
說明書
However, while illustrated and described herein as provided by “holes” extending into the base 202 of the processing device 200, one of skill in the art in possession of the present disclosure will recognize that other types of micro-strand heat dissipator connector features may be provided with the processing device 200 to allow the micro-strand heat dissipator elements (discussed below) to be connected to the processing device 200 in a variety of manners that will fall within the scope of the present disclosure as well. Furthermore, as described below, in other embodiments the micro-strand heat dissipator elements of the present disclosure may be integrated as part of processing devices, and thus the micro-strand heat dissipator connector features illustrated and described herein may be omitted, and the processing devices utilizing the micro-strand heat dissipation system of the present disclosure may instead be manufactured, fabricated, and/or otherwise produced with micro-strand heat dissipator element (i.e., rather than the micro-strand heat dissipator elements being connected to the processing device 200 via the micro-strand heat dissipator connector features as discussed in some of the embodiments below).
