With reference to FIGS. 8A, 8B, and 8C, another embodiment of the provisioning of the micro-strand heat dissipator elements 300 of the present disclosure on a processing device is illustrated. FIG. 8A illustrates a micro-strand heat dissipator element carrier 800 that is coupled to a plurality of the micro-strand heat dissipator elements 300 (e.g., to the top ends 302a of the base 302 on the micro-strand heat dissipator elements 300) and that positions those micro-strand heat dissipator elements 300 in a configuration that corresponds to the configuration of the micro-strand heat dissipator connector features on the processing device to which those micro-strand heat dissipator elements 300 will be connected, a micro-strand heat dissipator element carriers 802 that is coupled to a plurality of the micro-strand heat dissipator elements 300 (e.g., to the top ends 302a of the base 302 on the micro-strand heat dissipator elements 300) and that positions those micro-strand heat dissipator elements 300 in a configuration that corresponds to the configuration of the micro-strand heat dissipator connector features on the processing device to which those micro-strand heat dissipator elements 300 will be connected, and a micro-strand heat dissipator element carriers 804 that is coupled to a plurality of the micro-strand heat dissipator elements 300 (e.g., to the top ends 302a of the base 302 on the micro-strand heat dissipator elements 300) and that positions those micro-strand heat dissipator elements 300 in a configuration that corresponds to the configuration of the micro-strand heat dissipator connector features on the processing device to which those micro-strand heat dissipator elements 300 will be connected.