FIG. 8A also illustrates how the micro-strand heat dissipator element carrier 802 coupled to the plurality of the micro-strand heat dissipator elements 300 is positioned adjacent the side surface 202e of the processing device 700 such that the micro-strand heat dissipator elements 300 are aligned with corresponding micro-strand heat dissipator connector holes 702 defined by the base 202 of the processing device 700. While not explicitly illustrated, one of skill in the art in possession of the present disclosure will appreciate that the micro-strand heat dissipator element carrier 802 may be coupled to the plurality of the micro-strand heat dissipator elements 300 in a variety of manners that allows the plurality of the micro-strand heat dissipator elements 300 to be released from the micro-strand heat dissipator element carrier 802 as discussed below.
